APA (7th ed.) Citation

Sun, Y., Wang, H., Jiang, J., Wang, K., Bai, W., Chu, D., . . . Deng, W. (2026). Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions. Polymers (20734360), 18(9), 1122. https://doi.org/10.3390/polym18091122

Chicago Style (17th ed.) Citation

Sun, Yancai, et al. "Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions." Polymers (20734360) 18, no. 9 (2026): 1122. https://doi.org/10.3390/polym18091122.

MLA (9th ed.) Citation

Sun, Yancai, et al. "Numerical Investigation of Die Swell Behavior in EPDM Rubber Extrusion: Effects of Compound Formulation and Processing Conditions." Polymers (20734360), vol. 18, no. 9, 2026, p. 1122, https://doi.org/10.3390/polym18091122.