Design of a Three-Layer SIW Broadband 1x4 Dipole Patch Array Antenna Driven by Slot Feeding.

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Bibliographic Details
Title:	Design of a Three-Layer SIW Broadband 1x4 Dipole Patch Array Antenna Driven by Slot Feeding.
Authors:	Gao, Mingming¹, Huang, Ruize¹ 2844484378@qq.com, Du, Xuan¹, Tao, Bowen¹
Source:	Progress in Electromagnetics Research C. 2026, Vol. 169, p138-148. 11p.
Subjects:	Substrate integrated waveguides, Dipole array antennas, Slot antennas, Millimeter wave antennas, Broadband antennas, Millimeter wave communication systems, Power dividers
Abstract:	To address the demand for broadband, high-gain antennas in millimeter-wave communications, this paper proposes a stacked dipole patch array antenna based on substrate-integrated waveguide (SIW) technology. The design employs a three-layer structure with slot-coupled feeding to enhance radiation performance. First, an SIW feeding structure is integrated into the bottom layer to ensure efficient signal coupling. Second, the middle layer features an innovatively designed "wrench-shaped" patch with metal vias, which not only effectively broadens the bandwidth but also enhances gain in conjunction with the rectangular patches on both sides. Finally, rectangular dipole patches are introduced in the top layer as parasitic elements to further optimize high-frequency performance. Through a 1-to-4 corporate-feed power divider network, the antenna achieves a measured impedance bandwidth of 24.42% (24.12 GHz-30.83 GHz) and a center frequency gain of 11.02 dBi. While achieving miniaturization, this antenna combines high bandwidth with high gain, demonstrating its application potential in next-generation millimeter-wave wireless communication. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	To address the demand for broadband, high-gain antennas in millimeter-wave communications, this paper proposes a stacked dipole patch array antenna based on substrate-integrated waveguide (SIW) technology. The design employs a three-layer structure with slot-coupled feeding to enhance radiation performance. First, an SIW feeding structure is integrated into the bottom layer to ensure efficient signal coupling. Second, the middle layer features an innovatively designed "wrench-shaped" patch with metal vias, which not only effectively broadens the bandwidth but also enhances gain in conjunction with the rectangular patches on both sides. Finally, rectangular dipole patches are introduced in the top layer as parasitic elements to further optimize high-frequency performance. Through a 1-to-4 corporate-feed power divider network, the antenna achieves a measured impedance bandwidth of 24.42% (24.12 GHz-30.83 GHz) and a center frequency gain of 11.02 dBi. While achieving miniaturization, this antenna combines high bandwidth with high gain, demonstrating its application potential in next-generation millimeter-wave wireless communication. [ABSTRACT FROM AUTHOR]
ISSN:	19378718
DOI:	10.2528/PIERC26031706