Unraveling the Synergistic Mechanism and Performance Impact of Tetrazolium Violet: Towards Void-Free Copper Electroplating Filling for Ultra-High Aspect Ratio Through-Holes.
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| Title: | Unraveling the Synergistic Mechanism and Performance Impact of Tetrazolium Violet: Towards Void-Free Copper Electroplating Filling for Ultra-High Aspect Ratio Through-Holes. |
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| Authors: | Shi, Zongyuan1 (AUTHOR), Jin, Lei1 (AUTHOR) leijin@yznu.edu.cn, Bao, Rongan1 (AUTHOR), Yu, Miao2 (AUTHOR), Rao, Meng3 (AUTHOR), Wang, Yu3 (AUTHOR), Peng, Jinghui4 (AUTHOR), Li, Qinyuan4 (AUTHOR), Chen, Yuanming2 (AUTHOR) ymchen@uestc.edu.cn |
| Source: | Journal of The Electrochemical Society. 2026, Vol. 173 Issue 10, p1-10. 10p. |
| Subjects: | Tetrazolium, Copper plating, Molecular interactions, Circuit board manufacturing, Electrochemical analysis, Ab-initio calculations |
| Abstract: | PCBs serve as the nerve center of modern electronic devices, and the quality of the copper electroplating directly determines the reliability and performance of electronic products. Achieving void-free filling of ultra-high aspect ratio through-holes remains a critical challenge in high-density interconnection technology. In this work, a novel tetrazolium violet (VTZ) molecule was introduced in an acidic sulfate copper electroplating system. The structural, electronic and adsorption properties of VTZ were systematically investigated through DFT calculations, MD simulations and electrochemical analyses. Results reveal that VTZ exhibits strong planar adsorption on copper surfaces via combined chemical and physical interactions, facilitated by electron transfer from copper to its lowest unoccupied molecular orbital. Electrochemical measurements demonstrate that VTZ synergistically enhances the inhibiting effect of PEG while antagonizing the acceleration effect of SPS, thereby promoting filling of through-holes. Contact angle tests confirm that VTZ significantly improves the wettability of the electroplating bath, facilitating deeper penetration of additives. Practical electroplating experiments validate that the VTZ-containing bath achieves complete, void-free filling of through-holes, in contrast to the defective filling observed in the VTZ-free bath. Furthermore, VTZ induces a preferred (220) crystallographic orientation, and introduces beneficial compressive stress in the copper coating. This work provides a comprehensive understanding of the mechanism of VTZ as a high-performance additive and offers a practical strategy for void-free filling of ultra-high aspect ratio through-holes in advanced PCB manufacturing. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of The Electrochemical Society is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 193864976 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Unraveling the Synergistic Mechanism and Performance Impact of Tetrazolium Violet: Towards Void-Free Copper Electroplating Filling for Ultra-High Aspect Ratio Through-Holes. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Shi%2C+Zongyuan%22">Shi, Zongyuan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jin%2C+Lei%22">Jin, Lei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> leijin@yznu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Bao%2C+Rongan%22">Bao, Rongan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yu%2C+Miao%22">Yu, Miao</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Rao%2C+Meng%22">Rao, Meng</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Yu%22">Wang, Yu</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Peng%2C+Jinghui%22">Peng, Jinghui</searchLink><relatesTo>4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Li%2C+Qinyuan%22">Li, Qinyuan</searchLink><relatesTo>4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Yuanming%22">Chen, Yuanming</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> ymchen@uestc.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+The+Electrochemical+Society%22">Journal of The Electrochemical Society</searchLink>. 2026, Vol. 173 Issue 10, p1-10. 10p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Tetrazolium%22">Tetrazolium</searchLink><br /><searchLink fieldCode="DE" term="%22Copper+plating%22">Copper plating</searchLink><br /><searchLink fieldCode="DE" term="%22Molecular+interactions%22">Molecular interactions</searchLink><br /><searchLink fieldCode="DE" term="%22Circuit+board+manufacturing%22">Circuit board manufacturing</searchLink><br /><searchLink fieldCode="DE" term="%22Electrochemical+analysis%22">Electrochemical analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Ab-initio+calculations%22">Ab-initio calculations</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: PCBs serve as the nerve center of modern electronic devices, and the quality of the copper electroplating directly determines the reliability and performance of electronic products. Achieving void-free filling of ultra-high aspect ratio through-holes remains a critical challenge in high-density interconnection technology. In this work, a novel tetrazolium violet (VTZ) molecule was introduced in an acidic sulfate copper electroplating system. The structural, electronic and adsorption properties of VTZ were systematically investigated through DFT calculations, MD simulations and electrochemical analyses. Results reveal that VTZ exhibits strong planar adsorption on copper surfaces via combined chemical and physical interactions, facilitated by electron transfer from copper to its lowest unoccupied molecular orbital. Electrochemical measurements demonstrate that VTZ synergistically enhances the inhibiting effect of PEG while antagonizing the acceleration effect of SPS, thereby promoting filling of through-holes. Contact angle tests confirm that VTZ significantly improves the wettability of the electroplating bath, facilitating deeper penetration of additives. Practical electroplating experiments validate that the VTZ-containing bath achieves complete, void-free filling of through-holes, in contrast to the defective filling observed in the VTZ-free bath. Furthermore, VTZ induces a preferred (220) crystallographic orientation, and introduces beneficial compressive stress in the copper coating. This work provides a comprehensive understanding of the mechanism of VTZ as a high-performance additive and offers a practical strategy for void-free filling of ultra-high aspect ratio through-holes in advanced PCB manufacturing. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of The Electrochemical Society is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1149/1945-7111/ae697f Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 10 StartPage: 1 Subjects: – SubjectFull: Tetrazolium Type: general – SubjectFull: Copper plating Type: general – SubjectFull: Molecular interactions Type: general – SubjectFull: Circuit board manufacturing Type: general – SubjectFull: Electrochemical analysis Type: general – SubjectFull: Ab-initio calculations Type: general Titles: – TitleFull: Unraveling the Synergistic Mechanism and Performance Impact of Tetrazolium Violet: Towards Void-Free Copper Electroplating Filling for Ultra-High Aspect Ratio Through-Holes. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Shi, Zongyuan – PersonEntity: Name: NameFull: Jin, Lei – PersonEntity: Name: NameFull: Bao, Rongan – PersonEntity: Name: NameFull: Yu, Miao – PersonEntity: Name: NameFull: Rao, Meng – PersonEntity: Name: NameFull: Wang, Yu – PersonEntity: Name: NameFull: Peng, Jinghui – PersonEntity: Name: NameFull: Li, Qinyuan – PersonEntity: Name: NameFull: Chen, Yuanming IsPartOfRelationships: – BibEntity: Dates: – D: 28 M: 05 Text: 2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 00134651 Numbering: – Type: volume Value: 173 – Type: issue Value: 10 Titles: – TitleFull: Journal of The Electrochemical Society Type: main |
| ResultId | 1 |
