Interface‐Controlled Reliability of HDI Microvias: A Critical Review and Perspective.
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| Title: | Interface‐Controlled Reliability of HDI Microvias: A Critical Review and Perspective. |
|---|---|
| Authors: | Kamble, Vikram G.1,2 (AUTHOR) vikram-gourishankar.kamble@stud.unileoben.ac.at, Habib, Mohammad Rezwan (AUTHOR) mohabib@wiley.com |
| Source: | Advances in Materials Science & Engineering. 5/19/2026, Vol. 2026, p1-14. 14p. |
| Subjects: | Copper plating, Fabrication (Manufacturing), Printed circuits industry, Prediction models, Nondestructive testing, Reliability in engineering, Deterioration of materials |
| Abstract: | High‐density interconnect (HDI) microvias are foundational to modern information technologies, enabling high‐density routing in advanced computing, 5G, automotive, and aerospace electronics. As microvia dimensions shrink and stacked architectures become ubiquitous, reliability gains have stagnated despite continued geometric optimization. Growing evidence shows that reliability in advanced HDI microvias is increasingly governed by the coupled effects of via geometry, materials selection, and time‐dependent degradation at the buried electroless–target copper interface, where nanoscale void nucleation, progressive interfacial decohesion, and locally thinned copper layers control damage evolution and early failure. This interface constitutes a heterogeneous copper material system whose microstructure and bonding integrity are critically shaped by manufacturing physics, including laser drilling, surface conditioning, seed‐layer continuity, and electroplating dynamics, yet remain weakly represented in geometry‐focused qualification standards. Recent advances in nondestructive evaluation, data‐driven defect analysis, and physics‐informed modeling now enable progressive interface degradation to be detected, characterized, and assessed prior to field exposure. Treating the electroless–target interface as a functional materials system and a primary design variable provides a pathway toward predictive, mechanism‐based reliability frameworks for next‐generation electronic substrates. [ABSTRACT FROM AUTHOR] |
| Copyright of Advances in Materials Science & Engineering is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 193890412 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Interface‐Controlled Reliability of HDI Microvias: A Critical Review and Perspective. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Kamble%2C+Vikram+G%2E%22">Kamble, Vikram G.</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> vikram-gourishankar.kamble@stud.unileoben.ac.at</i><br /><searchLink fieldCode="AR" term="%22Habib%2C+Mohammad+Rezwan%22">Habib, Mohammad Rezwan</searchLink> (AUTHOR)<i> mohabib@wiley.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Advances+in+Materials+Science+%26+Engineering%22">Advances in Materials Science & Engineering</searchLink>. 5/19/2026, Vol. 2026, p1-14. 14p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Copper+plating%22">Copper plating</searchLink><br /><searchLink fieldCode="DE" term="%22Fabrication+%28Manufacturing%29%22">Fabrication (Manufacturing)</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuits+industry%22">Printed circuits industry</searchLink><br /><searchLink fieldCode="DE" term="%22Prediction+models%22">Prediction models</searchLink><br /><searchLink fieldCode="DE" term="%22Nondestructive+testing%22">Nondestructive testing</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+in+engineering%22">Reliability in engineering</searchLink><br /><searchLink fieldCode="DE" term="%22Deterioration+of+materials%22">Deterioration of materials</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: High‐density interconnect (HDI) microvias are foundational to modern information technologies, enabling high‐density routing in advanced computing, 5G, automotive, and aerospace electronics. As microvia dimensions shrink and stacked architectures become ubiquitous, reliability gains have stagnated despite continued geometric optimization. Growing evidence shows that reliability in advanced HDI microvias is increasingly governed by the coupled effects of via geometry, materials selection, and time‐dependent degradation at the buried electroless–target copper interface, where nanoscale void nucleation, progressive interfacial decohesion, and locally thinned copper layers control damage evolution and early failure. This interface constitutes a heterogeneous copper material system whose microstructure and bonding integrity are critically shaped by manufacturing physics, including laser drilling, surface conditioning, seed‐layer continuity, and electroplating dynamics, yet remain weakly represented in geometry‐focused qualification standards. Recent advances in nondestructive evaluation, data‐driven defect analysis, and physics‐informed modeling now enable progressive interface degradation to be detected, characterized, and assessed prior to field exposure. Treating the electroless–target interface as a functional materials system and a primary design variable provides a pathway toward predictive, mechanism‐based reliability frameworks for next‐generation electronic substrates. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Advances in Materials Science & Engineering is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1155/amse/1189580 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 14 StartPage: 1 Subjects: – SubjectFull: Copper plating Type: general – SubjectFull: Fabrication (Manufacturing) Type: general – SubjectFull: Printed circuits industry Type: general – SubjectFull: Prediction models Type: general – SubjectFull: Nondestructive testing Type: general – SubjectFull: Reliability in engineering Type: general – SubjectFull: Deterioration of materials Type: general Titles: – TitleFull: Interface‐Controlled Reliability of HDI Microvias: A Critical Review and Perspective. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Kamble, Vikram G. – PersonEntity: Name: NameFull: Habib, Mohammad Rezwan IsPartOfRelationships: – BibEntity: Dates: – D: 19 M: 05 Text: 5/19/2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 16878434 Numbering: – Type: volume Value: 2026 Titles: – TitleFull: Advances in Materials Science & Engineering Type: main |
| ResultId | 1 |
