Bibliographic Details
| Title: |
WIRE BONDING: 2026 WORKSHOP. |
| Authors: |
Sarangapani, Murali1, Seppaenen, Henri2 |
| Source: |
Advancing Microelectronics. 2026, Vol. 53 Issue 2, p36-41. 6p. |
| Subjects: |
Wire bonding (Electronic packaging), Microelectronic packaging, Silicon detectors, Integrated circuit interconnections, Ultrasonic welding, Automatic optical inspection |
| Abstract: |
The document details the agenda and technical presentations of WIREBONDING 2026, a conference focused on advances in wire bonding technologies for microelectronics packaging. Key topics include the development and application of fine wire materials such as 4N gold, 2N copper, and alloyed silver for memory, automotive, and LED sectors, as well as innovations in vertical wire bonding to enable high-density 3D packaging. The event also covers novel interconnect approaches like solder columns reinforced with palladium-coated copper wire, laser surface preparation effects on aluminum bonding, and updates to the JEDEC JESD22-B116B wire bond shear test method. Additionally, sessions address advanced optical metrology for wire bond inspection, ultrasonic pin welding for power electronics, and challenges in assembling high-density silicon detector modules for high-energy physics experiments. [Extracted from the article] |
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| Database: |
Engineering Source |
