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WIRE BONDING: 2026 WORKSHOP.

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Title: WIRE BONDING: 2026 WORKSHOP.
Authors: Sarangapani, Murali1, Seppaenen, Henri2
Source: Advancing Microelectronics. 2026, Vol. 53 Issue 2, p36-41. 6p.
Subjects: Wire bonding (Electronic packaging), Microelectronic packaging, Silicon detectors, Integrated circuit interconnections, Ultrasonic welding, Automatic optical inspection
Abstract: The document details the agenda and technical presentations of WIREBONDING 2026, a conference focused on advances in wire bonding technologies for microelectronics packaging. Key topics include the development and application of fine wire materials such as 4N gold, 2N copper, and alloyed silver for memory, automotive, and LED sectors, as well as innovations in vertical wire bonding to enable high-density 3D packaging. The event also covers novel interconnect approaches like solder columns reinforced with palladium-coated copper wire, laser surface preparation effects on aluminum bonding, and updates to the JEDEC JESD22-B116B wire bond shear test method. Additionally, sessions address advanced optical metrology for wire bond inspection, ultrasonic pin welding for power electronics, and challenges in assembling high-density silicon detector modules for high-energy physics experiments. [Extracted from the article]
Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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  Data: The document details the agenda and technical presentations of WIREBONDING 2026, a conference focused on advances in wire bonding technologies for microelectronics packaging. Key topics include the development and application of fine wire materials such as 4N gold, 2N copper, and alloyed silver for memory, automotive, and LED sectors, as well as innovations in vertical wire bonding to enable high-density 3D packaging. The event also covers novel interconnect approaches like solder columns reinforced with palladium-coated copper wire, laser surface preparation effects on aluminum bonding, and updates to the JEDEC JESD22-B116B wire bond shear test method. Additionally, sessions address advanced optical metrology for wire bond inspection, ultrasonic pin welding for power electronics, and challenges in assembling high-density silicon detector modules for high-energy physics experiments. [Extracted from the article]
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  Data: <i>Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – SubjectFull: Wire bonding (Electronic packaging)
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      – SubjectFull: Microelectronic packaging
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      – SubjectFull: Silicon detectors
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      – SubjectFull: Integrated circuit interconnections
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      – SubjectFull: Ultrasonic welding
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      – SubjectFull: Automatic optical inspection
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              Text: 2026
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