APA (7th ed.) Citation

Lee, S., & Yon, K. (2026). A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique. Journal of Mechanical Science & Technology, 40(6), 4431. https://doi.org/10.1007/s12206-026-0528-y

Chicago Style (17th ed.) Citation

Lee, Seong-Min, and Kyung-Yol Yon. "A Study on Factors Influencing Thermal-cycling-induced Passivation Damages in Semiconductor Devices Assembled Utilizing a Multi-chip Package Technique." Journal of Mechanical Science & Technology 40, no. 6 (2026): 4431. https://doi.org/10.1007/s12206-026-0528-y.

MLA (9th ed.) Citation

Lee, Seong-Min, and Kyung-Yol Yon. "A Study on Factors Influencing Thermal-cycling-induced Passivation Damages in Semiconductor Devices Assembled Utilizing a Multi-chip Package Technique." Journal of Mechanical Science & Technology, vol. 40, no. 6, 2026, p. 4431, https://doi.org/10.1007/s12206-026-0528-y.