A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique.
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| Title: | A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique. |
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| Authors: | Lee, Seong-Min1 (AUTHOR) smlee@inu.ac.kr, Yon, Kyung-Yol2 (AUTHOR) |
| Source: | Journal of Mechanical Science & Technology. Jun2026, Vol. 40 Issue 6, p4431-4438. 8p. |
| Subjects: | Semiconductor devices, Multichip modules (Microelectronics), Thermocycling, Polyimide films, Stress concentration, Thermal strain, Adhesives |
| Abstract: | Three main factors responsible for passivation cracking on chip surfaces in multi-chip packages were investigated under thermal cycling conditions: modification of the pattern structure, thermal mismatch variation between packaging materials, and different thermal-cycling amplitudes. The present experimental results show that adopting a protective layer (i.e., polyimide) to prevent passivation cracking is effective for up to 800 thermal cycles. However, this work also shows that thermal mismatch-induced deformation of polyimide at the grooved region of a passivation layer can become more severe with thermal cycling, eventually resulting in passivation cracking after 1000 thermal cycles from −55 °C to 125 °C as well as from −65 °C to 150 °C. However, replacing the conventional single adhesive layer with an advanced adhesive-filling base layer effectively prevented passivation cracking, even after 1000 thermal cycles from −65 °C to 150 °C. Through the Cramer-von Mises criterion this study also presents how the replaced adhesive-filling base layer can minimize thermal mismatch-induced stress responsible for passivation cracking during temperature variation. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Mechanical Science & Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 194452117 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Lee%2C+Seong-Min%22">Lee, Seong-Min</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> smlee@inu.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Yon%2C+Kyung-Yol%22">Yon, Kyung-Yol</searchLink><relatesTo>2</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Mechanical+Science+%26+Technology%22">Journal of Mechanical Science & Technology</searchLink>. Jun2026, Vol. 40 Issue 6, p4431-4438. 8p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Semiconductor+devices%22">Semiconductor devices</searchLink><br /><searchLink fieldCode="DE" term="%22Multichip+modules+%28Microelectronics%29%22">Multichip modules (Microelectronics)</searchLink><br /><searchLink fieldCode="DE" term="%22Thermocycling%22">Thermocycling</searchLink><br /><searchLink fieldCode="DE" term="%22Polyimide+films%22">Polyimide films</searchLink><br /><searchLink fieldCode="DE" term="%22Stress+concentration%22">Stress concentration</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+strain%22">Thermal strain</searchLink><br /><searchLink fieldCode="DE" term="%22Adhesives%22">Adhesives</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Three main factors responsible for passivation cracking on chip surfaces in multi-chip packages were investigated under thermal cycling conditions: modification of the pattern structure, thermal mismatch variation between packaging materials, and different thermal-cycling amplitudes. The present experimental results show that adopting a protective layer (i.e., polyimide) to prevent passivation cracking is effective for up to 800 thermal cycles. However, this work also shows that thermal mismatch-induced deformation of polyimide at the grooved region of a passivation layer can become more severe with thermal cycling, eventually resulting in passivation cracking after 1000 thermal cycles from −55 °C to 125 °C as well as from −65 °C to 150 °C. However, replacing the conventional single adhesive layer with an advanced adhesive-filling base layer effectively prevented passivation cracking, even after 1000 thermal cycles from −65 °C to 150 °C. Through the Cramer-von Mises criterion this study also presents how the replaced adhesive-filling base layer can minimize thermal mismatch-induced stress responsible for passivation cracking during temperature variation. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Mechanical Science & Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s12206-026-0528-y Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 4431 Subjects: – SubjectFull: Semiconductor devices Type: general – SubjectFull: Multichip modules (Microelectronics) Type: general – SubjectFull: Thermocycling Type: general – SubjectFull: Polyimide films Type: general – SubjectFull: Stress concentration Type: general – SubjectFull: Thermal strain Type: general – SubjectFull: Adhesives Type: general Titles: – TitleFull: A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lee, Seong-Min – PersonEntity: Name: NameFull: Yon, Kyung-Yol IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 06 Text: Jun2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 1738494X Numbering: – Type: volume Value: 40 – Type: issue Value: 6 Titles: – TitleFull: Journal of Mechanical Science & Technology Type: main |
| ResultId | 1 |
