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Micro-dimple profile optimization for MJECM with triangular-pore porous cathode.

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Title: Micro-dimple profile optimization for MJECM with triangular-pore porous cathode.
Authors: Wu, Zhangsen1 (AUTHOR), Ge, Zhenghui1 (AUTHOR), Wang, Rui1 (AUTHOR), Han, Zhao1 (AUTHOR) hanzhao@yzu.edu.cn, Zhu, Yongwei1 (AUTHOR)
Source: International Journal of Advanced Manufacturing Technology. May2026, Vol. 144 Issue 5/6, p3841-3855. 15p.
Subjects: Porous electrodes, Electrostatic fields, Electrochemical cutting, Computer simulation, Porosity
Abstract: Aiming at the core problem of edge electric field concentration-induced uneven electric field distribution which leads to poor roundness of micro-dimple formation and insufficient machining consistency in Masked Jet Electrochemical Machining (MJECM), an optimized design scheme of a porous cathode with "staggered arrangement + triangular pores" is proposed. The scheme takes edge electric field suppression and global electric field uniformity regulation as the core goal, and improves the forming quality of micro-dimple arrays through the structural synergetic regulation of electric field and flow field. Firstly, the electric field-flow field model was established through theoretical analysis to systematically study the effects of pore arrangement (regular arrangement vs. staggered arrangement), pore shape (triangular, square, circular), and mask aperture (0.25 ~ 0.5 mm) on machining characteristics. Subsequently, numerical simulation was used to optimize the key structural parameters of the cathode, and comparative machining experiments were carried out with the traditional slit cathode as the control group for verification. Simulation results show that the combined design of triangular pores and staggered arrangement can effectively suppress edge electric field concentration and improve flow field uniformity, with the micro-dimple roundness reaching 0.9465 at a mask aperture of 0.5 mm. Experimental results indicate that compared with the slit cathode, the average roundness of micro-dimple arrays machined by the triangular porous cathode is increased by 9.6% (from 0.876 to 0.96), the forming consistency between the edge and center areas is significantly improved, and it exhibits good machining adaptability within the mask aperture range of 0.25 ~ 0.5 mm. This study provides a new method for the cathode structure optimization of MJECM technology and has important engineering value for improving the machining accuracy and batch stability of metal microstructures. [ABSTRACT FROM AUTHOR]
Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 194518444
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Micro-dimple profile optimization for MJECM with triangular-pore porous cathode.
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  Label: Authors
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  Data: <searchLink fieldCode="AR" term="%22Wu%2C+Zhangsen%22">Wu, Zhangsen</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ge%2C+Zhenghui%22">Ge, Zhenghui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Rui%22">Wang, Rui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Han%2C+Zhao%22">Han, Zhao</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> hanzhao@yzu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Zhu%2C+Yongwei%22">Zhu, Yongwei</searchLink><relatesTo>1</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. May2026, Vol. 144 Issue 5/6, p3841-3855. 15p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Porous+electrodes%22">Porous electrodes</searchLink><br /><searchLink fieldCode="DE" term="%22Electrostatic+fields%22">Electrostatic fields</searchLink><br /><searchLink fieldCode="DE" term="%22Electrochemical+cutting%22">Electrochemical cutting</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+simulation%22">Computer simulation</searchLink><br /><searchLink fieldCode="DE" term="%22Porosity%22">Porosity</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Aiming at the core problem of edge electric field concentration-induced uneven electric field distribution which leads to poor roundness of micro-dimple formation and insufficient machining consistency in Masked Jet Electrochemical Machining (MJECM), an optimized design scheme of a porous cathode with "staggered arrangement + triangular pores" is proposed. The scheme takes edge electric field suppression and global electric field uniformity regulation as the core goal, and improves the forming quality of micro-dimple arrays through the structural synergetic regulation of electric field and flow field. Firstly, the electric field-flow field model was established through theoretical analysis to systematically study the effects of pore arrangement (regular arrangement vs. staggered arrangement), pore shape (triangular, square, circular), and mask aperture (0.25 ~ 0.5 mm) on machining characteristics. Subsequently, numerical simulation was used to optimize the key structural parameters of the cathode, and comparative machining experiments were carried out with the traditional slit cathode as the control group for verification. Simulation results show that the combined design of triangular pores and staggered arrangement can effectively suppress edge electric field concentration and improve flow field uniformity, with the micro-dimple roundness reaching 0.9465 at a mask aperture of 0.5 mm. Experimental results indicate that compared with the slit cathode, the average roundness of micro-dimple arrays machined by the triangular porous cathode is increased by 9.6% (from 0.876 to 0.96), the forming consistency between the edge and center areas is significantly improved, and it exhibits good machining adaptability within the mask aperture range of 0.25 ~ 0.5 mm. This study provides a new method for the cathode structure optimization of MJECM technology and has important engineering value for improving the machining accuracy and batch stability of metal microstructures. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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        Value: 10.1007/s00170-026-18142-1
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      – Code: eng
        Text: English
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        PageCount: 15
        StartPage: 3841
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        Type: general
      – SubjectFull: Electrostatic fields
        Type: general
      – SubjectFull: Electrochemical cutting
        Type: general
      – SubjectFull: Computer simulation
        Type: general
      – SubjectFull: Porosity
        Type: general
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      – TitleFull: Micro-dimple profile optimization for MJECM with triangular-pore porous cathode.
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            NameFull: Wu, Zhangsen
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            NameFull: Ge, Zhenghui
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            NameFull: Wang, Rui
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            NameFull: Han, Zhao
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            NameFull: Zhu, Yongwei
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            – D: 20
              M: 05
              Text: May2026
              Type: published
              Y: 2026
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