Packaging and Interconnect Reliability Constraints in NV-Center Quantum Sensors: A Microelectronics Integration Perspective.
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| Title: | Packaging and Interconnect Reliability Constraints in NV-Center Quantum Sensors: A Microelectronics Integration Perspective. |
|---|---|
| Authors: | Siow, Kim Shyong1 (AUTHOR) kimsiow@ukm.edu.my, Wang, Wei Jie1 (AUTHOR), Yap, Seong Ling2 (AUTHOR), Kwek, Leong Chuan3,4,5,6 (AUTHOR) |
| Source: | Journal of Electronic Materials. Jul2026, Vol. 55 Issue 7, p5760-5774. 15p. |
| Subjects: | Microelectronic packaging, Packaging materials, Integrated circuit interconnections, Scalability, Reliability in engineering |
| Abstract: | Quantum sensing technologies have made significant strides owing to advancements in spin coherence, quantum control, and readout techniques. This progress has brought platforms such as nitrogen-vacancy (NV) centers in diamonds closer towards practical applications. However, as these systems facilitate the transition from laboratory settings to commercial use, we argue that materials integration and packaging, not spin coherence, will define the performance limits of deployment-ready quantum sensors. In this review, we examine NV-center platforms through the lens of microelectronics integration, identifying packaging-induced effect, i.e., mechanical strain, thermal drift, and electromagnetic parasitic, as factors governing reproducibility and scalability of this technology. Here, we establish a direct link between package architecture and sensing fidelity on the basis of the analysis of host materials and surface termination, optical and microwave interfacing, and heterogeneous integration strategies, by drawing parallels with mature fields such as conventional sensor integration and high-reliability power electronics, we assess the relevance of advanced interconnect technologies, including sintered silver and copper, for quantum systems. These comparisons unveil both transferable design principles and significant limitations stemming from quantum-specific constraints. A major barrier to industrialization is the lack of standardized design rules and reliability frameworks. Overcoming this challenge will necessitate a shift from device-centric optimization to system-level engineering that prioritizes materials and interfaces. Our analysis positions packaging as a crucial enabler of scalable quantum sensing and outlines potential pathways toward manufacturable, field-deployable quantum technologies. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 194546606 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Packaging and Interconnect Reliability Constraints in NV-Center Quantum Sensors: A Microelectronics Integration Perspective. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Siow%2C+Kim+Shyong%22">Siow, Kim Shyong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> kimsiow@ukm.edu.my</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Wei+Jie%22">Wang, Wei Jie</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yap%2C+Seong+Ling%22">Yap, Seong Ling</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kwek%2C+Leong+Chuan%22">Kwek, Leong Chuan</searchLink><relatesTo>3,4,5,6</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>. Jul2026, Vol. 55 Issue 7, p5760-5774. 15p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Packaging+materials%22">Packaging materials</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuit+interconnections%22">Integrated circuit interconnections</searchLink><br /><searchLink fieldCode="DE" term="%22Scalability%22">Scalability</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+in+engineering%22">Reliability in engineering</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Quantum sensing technologies have made significant strides owing to advancements in spin coherence, quantum control, and readout techniques. This progress has brought platforms such as nitrogen-vacancy (NV) centers in diamonds closer towards practical applications. However, as these systems facilitate the transition from laboratory settings to commercial use, we argue that materials integration and packaging, not spin coherence, will define the performance limits of deployment-ready quantum sensors. In this review, we examine NV-center platforms through the lens of microelectronics integration, identifying packaging-induced effect, i.e., mechanical strain, thermal drift, and electromagnetic parasitic, as factors governing reproducibility and scalability of this technology. Here, we establish a direct link between package architecture and sensing fidelity on the basis of the analysis of host materials and surface termination, optical and microwave interfacing, and heterogeneous integration strategies, by drawing parallels with mature fields such as conventional sensor integration and high-reliability power electronics, we assess the relevance of advanced interconnect technologies, including sintered silver and copper, for quantum systems. These comparisons unveil both transferable design principles and significant limitations stemming from quantum-specific constraints. A major barrier to industrialization is the lack of standardized design rules and reliability frameworks. Overcoming this challenge will necessitate a shift from device-centric optimization to system-level engineering that prioritizes materials and interfaces. Our analysis positions packaging as a crucial enabler of scalable quantum sensing and outlines potential pathways toward manufacturable, field-deployable quantum technologies. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-026-12924-9 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 15 StartPage: 5760 Subjects: – SubjectFull: Microelectronic packaging Type: general – SubjectFull: Packaging materials Type: general – SubjectFull: Integrated circuit interconnections Type: general – SubjectFull: Scalability Type: general – SubjectFull: Reliability in engineering Type: general Titles: – TitleFull: Packaging and Interconnect Reliability Constraints in NV-Center Quantum Sensors: A Microelectronics Integration Perspective. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Siow, Kim Shyong – PersonEntity: Name: NameFull: Wang, Wei Jie – PersonEntity: Name: NameFull: Yap, Seong Ling – PersonEntity: Name: NameFull: Kwek, Leong Chuan IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: Jul2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 55 – Type: issue Value: 7 Titles: – TitleFull: Journal of Electronic Materials Type: main |
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