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Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.

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Title: Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.
Authors: Lin, Pengrong1,2 (AUTHOR), Tong, Zirui2,3 (AUTHOR), Xu, Shimeng1,2,3 (AUTHOR), Wang, Yiping1,3 (AUTHOR), Wang, Shang2,3 (AUTHOR) wangshang@hit.edu.cn, Tian, Yanhong3 (AUTHOR)
Source: Materials (1996-1944). Jun2026, Vol. 19 Issue 11, p2182. 11p.
Subjects: Sintering, Bond strengths, Thermal conductivity, Electronic packaging, Power electronics
Abstract: Highlights: We characterize a submicron triangular silver flake paste with high strength and low porosity at a low temperature. The submicron silver flakes have two different sintering stages. The sharp corners and edges of the submicron triangular silver flakes are easier to sinter than the surface. Silver pastes are promising joining materials for use in advanced electronic packaging, particularly in power electronics, due to their capacity for low-temperature joining and high-temperature operation. However, spherical silver particles suffer from low sintering efficiency and high porosity due to their limited contact areas. In this study, a submicron triangular silver flake paste was investigated to overcome these limitations. A high joint strength of 35.2 MPa with a low porosity of 9.48% was achieved at 250 °C via pressureless sintering. A relatively high thermal conductivity (134.9 W/(m·K)) was also achieved. This enhanced sintering performance is attributed to a unique mechanism involving distinct same-layer and inter-layer sintering processes at different temperatures. With these findings, we demonstrate that the submicron triangular silver flake paste is a high-strength, high-thermal-conductivity, low-temperature bonding material for advanced electronic packaging. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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Header DbId: egs
DbLabel: Engineering Source
An: 194587093
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Label: Title
  Group: Ti
  Data: Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.
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  Data: <searchLink fieldCode="AR" term="%22Lin%2C+Pengrong%22">Lin, Pengrong</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Tong%2C+Zirui%22">Tong, Zirui</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xu%2C+Shimeng%22">Xu, Shimeng</searchLink><relatesTo>1,2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Yiping%22">Wang, Yiping</searchLink><relatesTo>1,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Shang%22">Wang, Shang</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<i> wangshang@hit.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Tian%2C+Yanhong%22">Tian, Yanhong</searchLink><relatesTo>3</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Jun2026, Vol. 19 Issue 11, p2182. 11p.
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  Data: <searchLink fieldCode="DE" term="%22Sintering%22">Sintering</searchLink><br /><searchLink fieldCode="DE" term="%22Bond+strengths%22">Bond strengths</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Power+electronics%22">Power electronics</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Highlights: We characterize a submicron triangular silver flake paste with high strength and low porosity at a low temperature. The submicron silver flakes have two different sintering stages. The sharp corners and edges of the submicron triangular silver flakes are easier to sinter than the surface. Silver pastes are promising joining materials for use in advanced electronic packaging, particularly in power electronics, due to their capacity for low-temperature joining and high-temperature operation. However, spherical silver particles suffer from low sintering efficiency and high porosity due to their limited contact areas. In this study, a submicron triangular silver flake paste was investigated to overcome these limitations. A high joint strength of 35.2 MPa with a low porosity of 9.48% was achieved at 250 °C via pressureless sintering. A relatively high thermal conductivity (134.9 W/(m·K)) was also achieved. This enhanced sintering performance is attributed to a unique mechanism involving distinct same-layer and inter-layer sintering processes at different temperatures. With these findings, we demonstrate that the submicron triangular silver flake paste is a high-strength, high-thermal-conductivity, low-temperature bonding material for advanced electronic packaging. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.3390/ma19112182
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 2182
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      – SubjectFull: Sintering
        Type: general
      – SubjectFull: Bond strengths
        Type: general
      – SubjectFull: Thermal conductivity
        Type: general
      – SubjectFull: Electronic packaging
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      – SubjectFull: Power electronics
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      – TitleFull: Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging.
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            NameFull: Lin, Pengrong
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            NameFull: Tong, Zirui
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            NameFull: Xu, Shimeng
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            NameFull: Wang, Yiping
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            NameFull: Wang, Shang
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            NameFull: Tian, Yanhong
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            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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