Numerical Analysis and Strain Monitoring of the Curing Process in Ring-Shaped CFRP Components.
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| Title: | Numerical Analysis and Strain Monitoring of the Curing Process in Ring-Shaped CFRP Components. |
|---|---|
| Authors: | Tian, Yanhui1 (AUTHOR), Ding, Benjie1 (AUTHOR), Du, Jianke1 (AUTHOR), Zhang, Minghua1 (AUTHOR) zhangminghua@nbu.edu.cn |
| Source: | Polymers (20734360). Jun2026, Vol. 18 Issue 12, p1447. 19p. |
| Subjects: | Numerical analysis, Strain sensors, Epoxy resins, Composite material manufacturing, Residual stresses, Polymerization, Polymerization kinetics |
| Abstract: | Multi-field coupled numerical analysis and strain monitoring experiments were conducted for the curing process of a ring-shaped CFRP component. The curing kinetics and mechanical properties of LD-2184 epoxy resin were characterized using non-isothermal DSC, tensile testing, and CTE measurements. The curing reaction follows a single-stage autocatalytic mechanism with an activation energy of 54.73 kJ·mol−1. A piecewise curing kinetics equation was established. The elastic modulus of the fully cured resin is 2.810 GPa, and the coefficient of thermal expansion is 6.060 × 10−5 K−1. Composite ring specimens were fabricated using a wet winding process. FBG sensors were embedded to monitor axial strain during curing. A coupled numerical model was developed that includes heat conduction, curing kinetics, and curing deformation. ABAQUS was used to simulate the curing process of the composite ring. The results show a temperature gradient within the filament-wound layer. Thermo-chemical strain is similar between inner and outer regions. Total strain varies along the thickness due to mold constraint. Residual stress is governed by resin chemical shrinkage and thermal contraction during cooling. The difference between measured and simulated strain is 7.15%, which supports the validity of the multi-field coupled curing model. [ABSTRACT FROM AUTHOR] |
| Copyright of Polymers (20734360) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 194908316 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Numerical Analysis and Strain Monitoring of the Curing Process in Ring-Shaped CFRP Components. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Tian%2C+Yanhui%22">Tian, Yanhui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ding%2C+Benjie%22">Ding, Benjie</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Du%2C+Jianke%22">Du, Jianke</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Minghua%22">Zhang, Minghua</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> zhangminghua@nbu.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Polymers+%2820734360%29%22">Polymers (20734360)</searchLink>. Jun2026, Vol. 18 Issue 12, p1447. 19p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Numerical+analysis%22">Numerical analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Strain+sensors%22">Strain sensors</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Composite+material+manufacturing%22">Composite material manufacturing</searchLink><br /><searchLink fieldCode="DE" term="%22Residual+stresses%22">Residual stresses</searchLink><br /><searchLink fieldCode="DE" term="%22Polymerization%22">Polymerization</searchLink><br /><searchLink fieldCode="DE" term="%22Polymerization+kinetics%22">Polymerization kinetics</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Multi-field coupled numerical analysis and strain monitoring experiments were conducted for the curing process of a ring-shaped CFRP component. The curing kinetics and mechanical properties of LD-2184 epoxy resin were characterized using non-isothermal DSC, tensile testing, and CTE measurements. The curing reaction follows a single-stage autocatalytic mechanism with an activation energy of 54.73 kJ·mol−1. A piecewise curing kinetics equation was established. The elastic modulus of the fully cured resin is 2.810 GPa, and the coefficient of thermal expansion is 6.060 × 10−5 K−1. Composite ring specimens were fabricated using a wet winding process. FBG sensors were embedded to monitor axial strain during curing. A coupled numerical model was developed that includes heat conduction, curing kinetics, and curing deformation. ABAQUS was used to simulate the curing process of the composite ring. The results show a temperature gradient within the filament-wound layer. Thermo-chemical strain is similar between inner and outer regions. Total strain varies along the thickness due to mold constraint. Residual stress is governed by resin chemical shrinkage and thermal contraction during cooling. The difference between measured and simulated strain is 7.15%, which supports the validity of the multi-field coupled curing model. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Polymers (20734360) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=194908316 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/polym18121447 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 19 StartPage: 1447 Subjects: – SubjectFull: Numerical analysis Type: general – SubjectFull: Strain sensors Type: general – SubjectFull: Epoxy resins Type: general – SubjectFull: Composite material manufacturing Type: general – SubjectFull: Residual stresses Type: general – SubjectFull: Polymerization Type: general – SubjectFull: Polymerization kinetics Type: general Titles: – TitleFull: Numerical Analysis and Strain Monitoring of the Curing Process in Ring-Shaped CFRP Components. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Tian, Yanhui – PersonEntity: Name: NameFull: Ding, Benjie – PersonEntity: Name: NameFull: Du, Jianke – PersonEntity: Name: NameFull: Zhang, Minghua IsPartOfRelationships: – BibEntity: Dates: – D: 15 M: 06 Text: Jun2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 20734360 Numbering: – Type: volume Value: 18 – Type: issue Value: 12 Titles: – TitleFull: Polymers (20734360) Type: main |
| ResultId | 1 |
