APA (7th ed.) Citation

Yang, Z., Yang, J., Yu, Q., Chen, X., Xiao, Y., Zhu, Z., . . . Yang, C. (2026). Contact engineering of p-type CuI thin films: Interplay of work function alignment and interfacial chemical stability. Journal of Physics D: Applied Physics, 59(27), 1. https://doi.org/10.1088/1361-6463/ae830d

Chicago Style (17th ed.) Citation

Yang, Zhong-ao, Jia-lin Yang, Qiu-fei Yu, Xiao-jian Chen, Yi-fan Xiao, Zhi-wei Zhu, Zhuo-ran Ji, Jun-liang Zhao, and Chang Yang. "Contact Engineering of P-type CuI Thin Films: Interplay of Work Function Alignment and Interfacial Chemical Stability." Journal of Physics D: Applied Physics 59, no. 27 (2026): 1. https://doi.org/10.1088/1361-6463/ae830d.

MLA (9th ed.) Citation

Yang, Zhong-ao, et al. "Contact Engineering of P-type CuI Thin Films: Interplay of Work Function Alignment and Interfacial Chemical Stability." Journal of Physics D: Applied Physics, vol. 59, no. 27, 2026, p. 1, https://doi.org/10.1088/1361-6463/ae830d.