APA (7th ed.) Citation

Wei, H., He, Z., Ye, G., Shu, X., Peng, J., Chen, T., . . . Lu, X. (2026). A lightweight high precision real-time system for bonding ball–pad localization in industrial packaging inspection. Measurement Science & Technology, 37(27), 1. https://doi.org/10.1088/1361-6501/ae7f3f

Chicago Style (17th ed.) Citation

Wei, Haoran, Zhenzhi He, Guo Ye, Xiaotong Shu, Jingshong Peng, Tianchi Chen, Lianchao Sheng, and Xiangning Lu. "A Lightweight High Precision Real-time System for Bonding Ball–pad Localization in Industrial Packaging Inspection." Measurement Science & Technology 37, no. 27 (2026): 1. https://doi.org/10.1088/1361-6501/ae7f3f.

MLA (9th ed.) Citation

Wei, Haoran, et al. "A Lightweight High Precision Real-time System for Bonding Ball–pad Localization in Industrial Packaging Inspection." Measurement Science & Technology, vol. 37, no. 27, 2026, p. 1, https://doi.org/10.1088/1361-6501/ae7f3f.