APA (7th ed.) Citation

Fleischer, A. S., Chang, L., & Johnson, B. C. (2006). The effect of die attach voiding on the thermal resistance of chip level packages. Microelectronics Reliability, 46(5/6), 794. https://doi.org/10.1016/j.microrel.2005.01.019

Chicago Style (17th ed.) Citation

Fleischer, Amy S., Li-hsin Chang, and Barry C. Johnson. "The Effect of Die Attach Voiding on the Thermal Resistance of Chip Level Packages." Microelectronics Reliability 46, no. 5/6 (2006): 794. https://doi.org/10.1016/j.microrel.2005.01.019.

MLA (9th ed.) Citation

Fleischer, Amy S., et al. "The Effect of Die Attach Voiding on the Thermal Resistance of Chip Level Packages." Microelectronics Reliability, vol. 46, no. 5/6, 2006, p. 794, https://doi.org/10.1016/j.microrel.2005.01.019.