Fabrication of a tensile test for polymer micromechanics
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| Title: | Fabrication of a tensile test for polymer micromechanics |
|---|---|
| Authors: | Lang, Udo udo.lang@imes.mavt.ethz.ch, Reichen, Marcel1, Dual, Jürg1 |
| Source: | Microelectronic Engineering. Apr-Sep2006, Vol. 83 Issue 4-9, p1182-1184. 3p. |
| Subjects: | Micromechanics, Polymers, Plasma etching, Organic compounds |
| Abstract: | Abstract: In recent years one could observe the advent of polytronic systems e.g., systems whose electronics are based on organic materials. The use of cheap organic materials and inexpensive technologies such as roll-to-roll fabrication and ink-jet printing promise a new kind of electronics and applications. Devices under investigation are RF tags and displays based on organic light emitting diodes (OLEDs). One major advantage that these devices have in common is the possible flexible substrate they are fabricated on. As devices on flexible substrates will be bent during operation the reliability and therefore the knowledge of the mechanical properties of the materials used is important. Typical dimensions of functional organic layers in actual devices are in the range of several hundreds of nanometers. Therefore also for mechanical testing typical dimensions of the test specimens should be in the same range. We propose a test setup which enables the investigation of mechanical properties of submicrometer thick organic layers. It consists of a 1μm thick polyimide substrate and a deposited functional layer. In this paper we present the necessary fabrication process based on the Bosch deep etching process of silicon. [Copyright &y& Elsevier] |
| Copyright of Microelectronic Engineering is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 20574599 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Fabrication of a tensile test for polymer micromechanics – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Lang%2C+Udo%22">Lang, Udo</searchLink><i> udo.lang@imes.mavt.ethz.ch</i><br /><searchLink fieldCode="AR" term="%22Reichen%2C+Marcel%22">Reichen, Marcel</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Dual%2C+Jürg%22">Dual, Jürg</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Microelectronic+Engineering%22">Microelectronic Engineering</searchLink>. Apr-Sep2006, Vol. 83 Issue 4-9, p1182-1184. 3p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Micromechanics%22">Micromechanics</searchLink><br /><searchLink fieldCode="DE" term="%22Polymers%22">Polymers</searchLink><br /><searchLink fieldCode="DE" term="%22Plasma+etching%22">Plasma etching</searchLink><br /><searchLink fieldCode="DE" term="%22Organic+compounds%22">Organic compounds</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Abstract: In recent years one could observe the advent of polytronic systems e.g., systems whose electronics are based on organic materials. The use of cheap organic materials and inexpensive technologies such as roll-to-roll fabrication and ink-jet printing promise a new kind of electronics and applications. Devices under investigation are RF tags and displays based on organic light emitting diodes (OLEDs). One major advantage that these devices have in common is the possible flexible substrate they are fabricated on. As devices on flexible substrates will be bent during operation the reliability and therefore the knowledge of the mechanical properties of the materials used is important. Typical dimensions of functional organic layers in actual devices are in the range of several hundreds of nanometers. Therefore also for mechanical testing typical dimensions of the test specimens should be in the same range. We propose a test setup which enables the investigation of mechanical properties of submicrometer thick organic layers. It consists of a 1μm thick polyimide substrate and a deposited functional layer. In this paper we present the necessary fabrication process based on the Bosch deep etching process of silicon. [Copyright &y& Elsevier] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Microelectronic Engineering is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.mee.2006.01.050 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 3 StartPage: 1182 Subjects: – SubjectFull: Micromechanics Type: general – SubjectFull: Polymers Type: general – SubjectFull: Plasma etching Type: general – SubjectFull: Organic compounds Type: general Titles: – TitleFull: Fabrication of a tensile test for polymer micromechanics Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lang, Udo – PersonEntity: Name: NameFull: Reichen, Marcel – PersonEntity: Name: NameFull: Dual, Jürg IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 04 Text: Apr-Sep2006 Type: published Y: 2006 Identifiers: – Type: issn-print Value: 01679317 Numbering: – Type: volume Value: 83 – Type: issue Value: 4-9 Titles: – TitleFull: Microelectronic Engineering Type: main |
| ResultId | 1 |
