APA (7th ed.) Citation

Yu, D. Q., Oppermann, H., Kleff, J., & Hutter, M. (2009). Stability of AuSn eutectic solder cap on Au socket during reflow. Journal of Materials Science: Materials in Electronics, 20(1), 55. https://doi.org/10.1007/s10854-008-9606-4

Chicago Style (17th ed.) Citation

Yu, D. Q., H. Oppermann, J. Kleff, and M. Hutter. "Stability of AuSn Eutectic Solder Cap on Au Socket During Reflow." Journal of Materials Science: Materials in Electronics 20, no. 1 (2009): 55. https://doi.org/10.1007/s10854-008-9606-4.

MLA (9th ed.) Citation

Yu, D. Q., et al. "Stability of AuSn Eutectic Solder Cap on Au Socket During Reflow." Journal of Materials Science: Materials in Electronics, vol. 20, no. 1, 2009, p. 55, https://doi.org/10.1007/s10854-008-9606-4.