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Stability of AuSn eutectic solder cap on Au socket during reflow.

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Title: Stability of AuSn eutectic solder cap on Au socket during reflow.
Authors: Yu, D. Q.1 hansonydq@yahoo.com, Oppermann, H.2, Kleff, J.2, Hutter, M.2
Source: Journal of Materials Science: Materials in Electronics. Jan2009, Vol. 20 Issue 1, p55-59. 5p. 4 Diagrams, 1 Chart, 1 Graph.
Subjects: Eutectic alloys, Solder & soldering, Gold, Tin, Diameter, Wetting, Interfaces (Physical sciences), Surface chemistry, Stability (Mechanics)
Abstract: The stability of Au20Sn eutectic cap formed during reflow of Sn/Au bump was studied under multiple reflow cycles. For a 5 μm thick Sn layer, the eutectic caps formed for the bumps of 60 and 40 μm in diameters were quite stable up to 10 reflows and the ζ compound layer at the interface was a good barrier layer to prevent the exhaustion of the eutectic solders. However for 20 μm bumps, the relative larger eutectic volume resulted in side wall wetting. Therefore only small part of eutectic alloy was left on the top of the Au socket after one reflow. After three reflows Au socket was almost covered by a single ζ compound layer. The results identified that the maximum cap height formed during reflow should be smaller than half of the bump diameter to maintain it on the Au socket. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 35833978
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PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Stability of AuSn eutectic solder cap on Au socket during reflow.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Yu%2C+D%2E+Q%2E%22">Yu, D. Q.</searchLink><relatesTo>1</relatesTo><i> hansonydq@yahoo.com</i><br /><searchLink fieldCode="AR" term="%22Oppermann%2C+H%2E%22">Oppermann, H.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Kleff%2C+J%2E%22">Kleff, J.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Hutter%2C+M%2E%22">Hutter, M.</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Jan2009, Vol. 20 Issue 1, p55-59. 5p. 4 Diagrams, 1 Chart, 1 Graph.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Eutectic+alloys%22">Eutectic alloys</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink><br /><searchLink fieldCode="DE" term="%22Gold%22">Gold</searchLink><br /><searchLink fieldCode="DE" term="%22Tin%22">Tin</searchLink><br /><searchLink fieldCode="DE" term="%22Diameter%22">Diameter</searchLink><br /><searchLink fieldCode="DE" term="%22Wetting%22">Wetting</searchLink><br /><searchLink fieldCode="DE" term="%22Interfaces+%28Physical+sciences%29%22">Interfaces (Physical sciences)</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+chemistry%22">Surface chemistry</searchLink><br /><searchLink fieldCode="DE" term="%22Stability+%28Mechanics%29%22">Stability (Mechanics)</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The stability of Au20Sn eutectic cap formed during reflow of Sn/Au bump was studied under multiple reflow cycles. For a 5 μm thick Sn layer, the eutectic caps formed for the bumps of 60 and 40 μm in diameters were quite stable up to 10 reflows and the ζ compound layer at the interface was a good barrier layer to prevent the exhaustion of the eutectic solders. However for 20 μm bumps, the relative larger eutectic volume resulted in side wall wetting. Therefore only small part of eutectic alloy was left on the top of the Au socket after one reflow. After three reflows Au socket was almost covered by a single ζ compound layer. The results identified that the maximum cap height formed during reflow should be smaller than half of the bump diameter to maintain it on the Au socket. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-008-9606-4
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 5
        StartPage: 55
    Subjects:
      – SubjectFull: Eutectic alloys
        Type: general
      – SubjectFull: Solder & soldering
        Type: general
      – SubjectFull: Gold
        Type: general
      – SubjectFull: Tin
        Type: general
      – SubjectFull: Diameter
        Type: general
      – SubjectFull: Wetting
        Type: general
      – SubjectFull: Interfaces (Physical sciences)
        Type: general
      – SubjectFull: Surface chemistry
        Type: general
      – SubjectFull: Stability (Mechanics)
        Type: general
    Titles:
      – TitleFull: Stability of AuSn eutectic solder cap on Au socket during reflow.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Yu, D. Q.
      – PersonEntity:
          Name:
            NameFull: Oppermann, H.
      – PersonEntity:
          Name:
            NameFull: Kleff, J.
      – PersonEntity:
          Name:
            NameFull: Hutter, M.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 01
              Text: Jan2009
              Type: published
              Y: 2009
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 20
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1