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Characterization of low-temperature silicon nitride films produced by inductively coupled plasma chemical vapor deposition.

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Title: Characterization of low-temperature silicon nitride films produced by inductively coupled plasma chemical vapor deposition.
Authors: Xu, Q.1 q.xu@moreheadstate.edu, Ra, Y.2, Bachman, M.3, Li, G. P.3
Source: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films. Jan2009, Vol. 27 Issue 1, p145-156. 12p. 1 Black and White Photograph, 1 Diagram, 2 Charts, 8 Graphs.
Subjects: Silicon nitride, Chemical vapor deposition, Fourier transform infrared spectroscopy, Atomic force microscopy, Scanning probe microscopy, High temperatures
Abstract: Silicon nitride films were synthesized at 170 °C by using inductively coupled plasma chemical vapor deposition under three microwave power conditions of 500, 800, and 1000 W. The chemical, physical and electrical properties of the deposited silicon nitride films were characterized by Fourier transform infrared, wet etching, atomic force microscopy, ellipsometry, J-V, and C-V measurements of metal-insulator-semiconductor. The microwave power for film deposition is found to play an important role at the films’ properties. A high microwave power reduces the retention of hydrogen in a form of Si–H and N–H atomic bonds. The microwave power significantly affects the density of pin holes; the 800 W film has the lowest density of pin holes. In general, the low-temperature silicon nitride films possess better surface roughness than the conventional silicon nitride films produced at higher temperatures. The low-temperature silicon nitride films exhibit an abrupt breakdown, a characteristic of avalanche breakdown. The variation in breakdown strength is correlated with the change in pin-hole density, and the 800 W silicon nitride film possesses the highest breakdown strength. The microwave power has limited influences on leakage current and resistivity of the films. All the low-temperature silicon nitride films are characterized by high-density fixed charges and interface charge traps, of which both densities vary slightly with the microwave power for film deposition. [ABSTRACT FROM AUTHOR]
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Abstract:Silicon nitride films were synthesized at 170 °C by using inductively coupled plasma chemical vapor deposition under three microwave power conditions of 500, 800, and 1000 W. The chemical, physical and electrical properties of the deposited silicon nitride films were characterized by Fourier transform infrared, wet etching, atomic force microscopy, ellipsometry, J-V, and C-V measurements of metal-insulator-semiconductor. The microwave power for film deposition is found to play an important role at the films’ properties. A high microwave power reduces the retention of hydrogen in a form of Si–H and N–H atomic bonds. The microwave power significantly affects the density of pin holes; the 800 W film has the lowest density of pin holes. In general, the low-temperature silicon nitride films possess better surface roughness than the conventional silicon nitride films produced at higher temperatures. The low-temperature silicon nitride films exhibit an abrupt breakdown, a characteristic of avalanche breakdown. The variation in breakdown strength is correlated with the change in pin-hole density, and the 800 W silicon nitride film possesses the highest breakdown strength. The microwave power has limited influences on leakage current and resistivity of the films. All the low-temperature silicon nitride films are characterized by high-density fixed charges and interface charge traps, of which both densities vary slightly with the microwave power for film deposition. [ABSTRACT FROM AUTHOR]
ISSN:07342101
DOI:10.1116/1.3054133