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Alloying modification of Sn–Ag–Cu solders by manganese and titanium

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Title: Alloying modification of Sn–Ag–Cu solders by manganese and titanium
Authors: Lin, Li-Wei1, Song, Jenn-Ming1 samsong@mail.ndhu.edu.tw, Lai, Yi-Shao2, Chiu, Ying-Ta2, Lee, Ning-Cheng3, Uan, Jun-Yen4
Source: Microelectronics Reliability. Mar2009, Vol. 49 Issue 3, p235-241. 7p.
Subjects: Microalloying, Solder & soldering, Microstructure, Solidification, Mechanical behavior of materials, Eutectic alloys, Indentation (Materials science)
Abstract: Abstract: Effects of Mn and Ti additives on the microstructure and solidification behavior of Sn–1.0Ag–0.5Cu alloys (SAC105), as well as mechanical properties, were investigated in this study. Results show that alloying of Mn and Ti resulted in dramatically reduced undercooling, coarse eutectic structure and extended volume fraction of proeutectic Sn of which the dendritic size was refined. Those thermal and microstructural changes might be ascribed to the formation of MnSn2 and Ti2Sn3 intermetallic compounds (IMCs) which appeared respectively in the Mn-doped and Ti-doped samples. Nanoindentation tests demonstrated that the heterogeneous IMCs produced by alloying were harder and stiffer than the inherent IMCs, Ag3Sn and Cu6Sn5. Worthy of notice is that the elastic modulus of SAC105 alloys decreased with only a minor alloying addition due to the shrunken eutectic regions and coarsened eutectic microconstituents. With a larger quantity of additives, an ascending elastic modulus could be obtained because of the strengthening effect by hard heterogeneous compounds. [Copyright &y& Elsevier]
Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 36780386
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Alloying modification of Sn–Ag–Cu solders by manganese and titanium
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  Data: <searchLink fieldCode="AR" term="%22Lin%2C+Li-Wei%22">Lin, Li-Wei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Song%2C+Jenn-Ming%22">Song, Jenn-Ming</searchLink><relatesTo>1</relatesTo><i> samsong@mail.ndhu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Lai%2C+Yi-Shao%22">Lai, Yi-Shao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Chiu%2C+Ying-Ta%22">Chiu, Ying-Ta</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Lee%2C+Ning-Cheng%22">Lee, Ning-Cheng</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Uan%2C+Jun-Yen%22">Uan, Jun-Yen</searchLink><relatesTo>4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Mar2009, Vol. 49 Issue 3, p235-241. 7p.
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  Data: <searchLink fieldCode="DE" term="%22Microalloying%22">Microalloying</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink><br /><searchLink fieldCode="DE" term="%22Microstructure%22">Microstructure</searchLink><br /><searchLink fieldCode="DE" term="%22Solidification%22">Solidification</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+behavior+of+materials%22">Mechanical behavior of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Eutectic+alloys%22">Eutectic alloys</searchLink><br /><searchLink fieldCode="DE" term="%22Indentation+%28Materials+science%29%22">Indentation (Materials science)</searchLink>
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  Data: Abstract: Effects of Mn and Ti additives on the microstructure and solidification behavior of Sn–1.0Ag–0.5Cu alloys (SAC105), as well as mechanical properties, were investigated in this study. Results show that alloying of Mn and Ti resulted in dramatically reduced undercooling, coarse eutectic structure and extended volume fraction of proeutectic Sn of which the dendritic size was refined. Those thermal and microstructural changes might be ascribed to the formation of MnSn2 and Ti2Sn3 intermetallic compounds (IMCs) which appeared respectively in the Mn-doped and Ti-doped samples. Nanoindentation tests demonstrated that the heterogeneous IMCs produced by alloying were harder and stiffer than the inherent IMCs, Ag3Sn and Cu6Sn5. Worthy of notice is that the elastic modulus of SAC105 alloys decreased with only a minor alloying addition due to the shrunken eutectic regions and coarsened eutectic microconstituents. With a larger quantity of additives, an ascending elastic modulus could be obtained because of the strengthening effect by hard heterogeneous compounds. [Copyright &y& Elsevier]
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  Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1016/j.microrel.2008.10.001
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        Text: English
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      – SubjectFull: Solder & soldering
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      – SubjectFull: Solidification
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      – SubjectFull: Mechanical behavior of materials
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      – SubjectFull: Eutectic alloys
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      – SubjectFull: Indentation (Materials science)
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      – TitleFull: Alloying modification of Sn–Ag–Cu solders by manganese and titanium
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              Text: Mar2009
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              Y: 2009
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