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Jet ECD planting and seed layers for sub-0.10mum Cu interconnects.

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Title: Jet ECD planting and seed layers for sub-0.10mum Cu interconnects.
Authors: Cohen, Uri, Tzanavaras, George
Source: Solid State Technology. May2001, Vol. 44 Issue 5, p61. 5p. 1 Color Photograph, 1 Black and White Photograph, 5 Diagrams, 1 Graph.
Subjects: Electroplating, Electrochemical metallizing
Abstract: Presents an inhibition model which explains the mechanism and the beneficial effects of Jet electrochemical deposition plating. Problems with conventional physical vapor deposition and chemical vapor deposition seed layers; Details on the plating inhibition model; Information on conventional Cu seed layers.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 4425814
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Group: Ti
  Data: Jet ECD planting and seed layers for sub-0.10mum Cu interconnects.
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  Data: <searchLink fieldCode="AR" term="%22Cohen%2C+Uri%22">Cohen, Uri</searchLink><br /><searchLink fieldCode="AR" term="%22Tzanavaras%2C+George%22">Tzanavaras, George</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Solid+State+Technology%22">Solid State Technology</searchLink>. May2001, Vol. 44 Issue 5, p61. 5p. 1 Color Photograph, 1 Black and White Photograph, 5 Diagrams, 1 Graph.
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  Label: Abstract
  Group: Ab
  Data: Presents an inhibition model which explains the mechanism and the beneficial effects of Jet electrochemical deposition plating. Problems with conventional physical vapor deposition and chemical vapor deposition seed layers; Details on the plating inhibition model; Information on conventional Cu seed layers.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=4425814
RecordInfo BibRecord:
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      – Code: eng
        Text: English
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        PageCount: 5
        StartPage: 61
    Subjects:
      – SubjectFull: Electroplating
        Type: general
      – SubjectFull: Electrochemical metallizing
        Type: general
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      – TitleFull: Jet ECD planting and seed layers for sub-0.10mum Cu interconnects.
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            NameFull: Cohen, Uri
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              Text: May2001
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              Y: 2001
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