Jet ECD planting and seed layers for sub-0.10mum Cu interconnects.
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| Title: | Jet ECD planting and seed layers for sub-0.10mum Cu interconnects. |
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| Authors: | Cohen, Uri, Tzanavaras, George |
| Source: | Solid State Technology. May2001, Vol. 44 Issue 5, p61. 5p. 1 Color Photograph, 1 Black and White Photograph, 5 Diagrams, 1 Graph. |
| Subjects: | Electroplating, Electrochemical metallizing |
| Abstract: | Presents an inhibition model which explains the mechanism and the beneficial effects of Jet electrochemical deposition plating. Problems with conventional physical vapor deposition and chemical vapor deposition seed layers; Details on the plating inhibition model; Information on conventional Cu seed layers. |
| Database: | Engineering Source |
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