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Microencapsulation of imidazole curing agent for epoxy resin

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Title: Microencapsulation of imidazole curing agent for epoxy resin
Authors: Ham, Young Rok1, Lee, Dong Ho1, Kim, Sun Hee1, Shin, Young Jae2, Yang, Minhee1, Shin, Jae Sup1 jsshin@chungbuk.ac.kr
Source: Journal of Industrial & Engineering Chemistry. Sep2010, Vol. 16 Issue 5, p728-733. 6p.
Subjects: Microencapsulation, Imidazoles, Epoxy resins, Solvents, Molecular weights, Anisotropy
Abstract: Abstract: An epoxy resin–imidazole system was used to form the adhesives for the anisotropic conducting film (ACF), and a latent curing system was necessary for the ACF. In this study, 2-phenylimidazole (2PhI) was encapsulated for the latent curing system. Polycaprolactone (PCL) was used as the wall material, and the solvent evaporation method was used to form the microcapsule. The effects of the ratio of 2PhI and PCL, and the effects of the molecular weight of PCL were investigated during the microcapsule formation. The amount of 2PhI in the microcapsule was measured using TGA. The permeability of the microcapsules was measured in ethanol, and the shelf life of the microcapsules was also studied for the epoxy resin. The curing behavior was examined using DSC. In the curing reaction of the epoxy resin, the microcapsule of 2PhI exhibited a delayed kinetic behavior compared to pure 2PhI. This microcapsule of 2PhI exhibited a long shelf life, and the curing did not occur in this microcapsule–epoxy resin system at 20°C for more than 30 days. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Industrial & Engineering Chemistry is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 53309255
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
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  Data: Microencapsulation of imidazole curing agent for epoxy resin
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  Data: <searchLink fieldCode="AR" term="%22Ham%2C+Young+Rok%22">Ham, Young Rok</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Lee%2C+Dong+Ho%22">Lee, Dong Ho</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kim%2C+Sun+Hee%22">Kim, Sun Hee</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Shin%2C+Young+Jae%22">Shin, Young Jae</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Yang%2C+Minhee%22">Yang, Minhee</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Shin%2C+Jae+Sup%22">Shin, Jae Sup</searchLink><relatesTo>1</relatesTo><i> jsshin@chungbuk.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Industrial+%26+Engineering+Chemistry%22">Journal of Industrial & Engineering Chemistry</searchLink>. Sep2010, Vol. 16 Issue 5, p728-733. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Microencapsulation%22">Microencapsulation</searchLink><br /><searchLink fieldCode="DE" term="%22Imidazoles%22">Imidazoles</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Solvents%22">Solvents</searchLink><br /><searchLink fieldCode="DE" term="%22Molecular+weights%22">Molecular weights</searchLink><br /><searchLink fieldCode="DE" term="%22Anisotropy%22">Anisotropy</searchLink>
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  Data: Abstract: An epoxy resin–imidazole system was used to form the adhesives for the anisotropic conducting film (ACF), and a latent curing system was necessary for the ACF. In this study, 2-phenylimidazole (2PhI) was encapsulated for the latent curing system. Polycaprolactone (PCL) was used as the wall material, and the solvent evaporation method was used to form the microcapsule. The effects of the ratio of 2PhI and PCL, and the effects of the molecular weight of PCL were investigated during the microcapsule formation. The amount of 2PhI in the microcapsule was measured using TGA. The permeability of the microcapsules was measured in ethanol, and the shelf life of the microcapsules was also studied for the epoxy resin. The curing behavior was examined using DSC. In the curing reaction of the epoxy resin, the microcapsule of 2PhI exhibited a delayed kinetic behavior compared to pure 2PhI. This microcapsule of 2PhI exhibited a long shelf life, and the curing did not occur in this microcapsule–epoxy resin system at 20°C for more than 30 days. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
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  Data: <i>Copyright of Journal of Industrial & Engineering Chemistry is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1016/j.jiec.2010.07.011
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      – Code: eng
        Text: English
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        PageCount: 6
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        Type: general
      – SubjectFull: Imidazoles
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      – SubjectFull: Epoxy resins
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      – SubjectFull: Molecular weights
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      – SubjectFull: Anisotropy
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              M: 09
              Text: Sep2010
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