Thermal properties and structure of TeGa2Sb7 thin films for phase-change memory

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Title: Thermal properties and structure of TeGa2Sb7 thin films for phase-change memory
Authors: Chu, Yung-Ching1, Chang, Po-Chin1, Kao, Kin-Fu1, Chang, Shih-Ching1, Chin, Tsung-Shune1,2 tschin@mx.nthu.edu.tw
Source: Thin Solid Films. Oct2010, Vol. 518 Issue 24, p7316-7319. 4p.
Subjects: Thin films, Thermal properties of metals, Molecular structure, Chemical systems, Computer storage devices, Phase transitions, Crystallization, Chemical kinetics
Abstract: Abstract: We disclose in this paper properties of a composition TeGa2Sb7 selected from the pseudo-tie line Sb80Te20–GaSb in Te–Ga–Sb system. TeGa2Sb7 film possesses crystallization temperature 236°C and activation-energy of crystallization 5.76eV, by Kissinger''s peak-shift method. The study on failure-time versus isothermal temperatures fits in an Arrhenius plot, which can be extrapolated to the 10year data retention at 200°C. Grazing-incident X-ray diffraction shows that crystallized TeGa2Sb7 films compose of a single HCP phase. Electrical resistance decreases by four orders-of-magnitude upon crystallization. Memory switching is verified using a bridge-memory-cell. TeGa2Sb7 is a potential for phase-change memory anticipating high thermal stability. [Copyright &y& Elsevier]
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Abstract:Abstract: We disclose in this paper properties of a composition TeGa2Sb7 selected from the pseudo-tie line Sb80Te20–GaSb in Te–Ga–Sb system. TeGa2Sb7 film possesses crystallization temperature 236°C and activation-energy of crystallization 5.76eV, by Kissinger''s peak-shift method. The study on failure-time versus isothermal temperatures fits in an Arrhenius plot, which can be extrapolated to the 10year data retention at 200°C. Grazing-incident X-ray diffraction shows that crystallized TeGa2Sb7 films compose of a single HCP phase. Electrical resistance decreases by four orders-of-magnitude upon crystallization. Memory switching is verified using a bridge-memory-cell. TeGa2Sb7 is a potential for phase-change memory anticipating high thermal stability. [Copyright &y& Elsevier]
ISSN:00406090
DOI:10.1016/j.tsf.2010.04.101