Advanced Thermal Management Augments System Reliability.
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| Title: | Advanced Thermal Management Augments System Reliability. |
|---|---|
| Authors: | Pantone, Nancy nancy.pantone@us.kontron.com, Wieborg, Matt matt.wieborg@us.kontron.com |
| Source: | Electronic Design. 10/7/2010, Vol. 58 Issue 13, p52-57. 6p. 3 Color Photographs. |
| Subjects: | Embedded computer system design & construction, Thermal insulation, Thermal analysis, Temperature control, Electronic circuits |
| Abstract: | The article discusses thermal management which is considered in designing embedded systems. It mentions that decisions for the systems' design cycle should identify how the heat is generated inside the system. It says that thermal management intends to assure that the components of the system work in a fixed functional temperature limit to accomplish optimal performance. It adds that design requirements are considered in determining the cost-efficient thermal management method. |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 54441925 AccessLevel: 6 PubType: Periodical PubTypeId: serialPeriodical PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Advanced Thermal Management Augments System Reliability. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Pantone%2C+Nancy%22">Pantone, Nancy</searchLink><i> nancy.pantone@us.kontron.com</i><br /><searchLink fieldCode="AR" term="%22Wieborg%2C+Matt%22">Wieborg, Matt</searchLink><i> matt.wieborg@us.kontron.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Electronic+Design%22">Electronic Design</searchLink>. 10/7/2010, Vol. 58 Issue 13, p52-57. 6p. 3 Color Photographs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Embedded+computer+system+design+%26+construction%22">Embedded computer system design & construction</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+insulation%22">Thermal insulation</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+analysis%22">Thermal analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+control%22">Temperature control</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+circuits%22">Electronic circuits</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The article discusses thermal management which is considered in designing embedded systems. It mentions that decisions for the systems' design cycle should identify how the heat is generated inside the system. It says that thermal management intends to assure that the components of the system work in a fixed functional temperature limit to accomplish optimal performance. It adds that design requirements are considered in determining the cost-efficient thermal management method. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=54441925 |
| RecordInfo | BibRecord: BibEntity: Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 52 Subjects: – SubjectFull: Embedded computer system design & construction Type: general – SubjectFull: Thermal insulation Type: general – SubjectFull: Thermal analysis Type: general – SubjectFull: Temperature control Type: general – SubjectFull: Electronic circuits Type: general Titles: – TitleFull: Advanced Thermal Management Augments System Reliability. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Pantone, Nancy – PersonEntity: Name: NameFull: Wieborg, Matt IsPartOfRelationships: – BibEntity: Dates: – D: 07 M: 10 Text: 10/7/2010 Type: published Y: 2010 Identifiers: – Type: issn-print Value: 00134872 Numbering: – Type: volume Value: 58 – Type: issue Value: 13 Titles: – TitleFull: Electronic Design Type: main |
| ResultId | 1 |
