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Monitoring plasma conditions.

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Bibliographic Details
Title: Monitoring plasma conditions.
Authors: Kim, Byungwhan, Choi, Wookyung
Source: Solid State Technology. Nov2001, Vol. 44 Issue 11, p73. 5p. 1 Diagram, 6 Graphs.
Subjects: Plasma gases, Machine tool monitoring, Manufacturing processes
Abstract: Examines an alternative method for monitoring the condition of plasma in the etch and deposition wafer processing. Importance of plasma monitoring; Acquisition of experimental data; Basic theory of discrete wavelet.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 5476122
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Monitoring plasma conditions.
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  Data: <searchLink fieldCode="AR" term="%22Kim%2C+Byungwhan%22">Kim, Byungwhan</searchLink><br /><searchLink fieldCode="AR" term="%22Choi%2C+Wookyung%22">Choi, Wookyung</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Solid+State+Technology%22">Solid State Technology</searchLink>. Nov2001, Vol. 44 Issue 11, p73. 5p. 1 Diagram, 6 Graphs.
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  Data: Examines an alternative method for monitoring the condition of plasma in the etch and deposition wafer processing. Importance of plasma monitoring; Acquisition of experimental data; Basic theory of discrete wavelet.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=5476122
RecordInfo BibRecord:
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 5
        StartPage: 73
    Subjects:
      – SubjectFull: Plasma gases
        Type: general
      – SubjectFull: Machine tool monitoring
        Type: general
      – SubjectFull: Manufacturing processes
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      – TitleFull: Monitoring plasma conditions.
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            NameFull: Kim, Byungwhan
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            NameFull: Choi, Wookyung
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            – D: 01
              M: 11
              Text: Nov2001
              Type: published
              Y: 2001
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              Value: 11
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