Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications.
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| Title: | Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications. |
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| Authors: | Ramesham, Rajeshuni1 Rajeshuni.Ramesham@jpl.nasa.gov |
| Source: | Journal of Microelectronic & Electronic Packaging. 2010 1st Quarter, Vol. 7 Issue 1, p16-24. 9p. 7 Black and White Photographs, 2 Diagrams, 1 Chart, 11 Graphs. |
| Subjects: | Electronics packaging, Ceramic superconductors, Integrated circuit interconnections, Astronautical instruments, Microprocessors, Strength of materials, Solder & soldering, Performance technology, Optical quality control |
| Abstract: | Ceramic column grid array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short-term and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected nondestructively, and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short- and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27 × 27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects was continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable as the number of thermal cycles increases. This paper will describe the experimental test results of CCGA testing under extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at the 137th thermal cycle and 63.2% failures of daisy chains have occurred by about 664 thermal cycles. The shape parameter extracted from the Weibull plot was about 1.47, which indicates the failures were related to failures that occurred during the flat region or useful life region of the standard bathtub curve. Based on this experimental test data, one can use the CCGAs for the temperature range studied for ∼100 thermal cycles (ΔT = 310°C, 5°C/minute, and 15 mm dwell) with a high degree of confidence for high reliability space and other applications. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 56104213 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Ramesham%2C+Rajeshuni%22">Ramesham, Rajeshuni</searchLink><relatesTo>1</relatesTo><i> Rajeshuni.Ramesham@jpl.nasa.gov</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2010 1st Quarter, Vol. 7 Issue 1, p16-24. 9p. 7 Black and White Photographs, 2 Diagrams, 1 Chart, 11 Graphs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Ceramic+superconductors%22">Ceramic superconductors</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuit+interconnections%22">Integrated circuit interconnections</searchLink><br /><searchLink fieldCode="DE" term="%22Astronautical+instruments%22">Astronautical instruments</searchLink><br /><searchLink fieldCode="DE" term="%22Microprocessors%22">Microprocessors</searchLink><br /><searchLink fieldCode="DE" term="%22Strength+of+materials%22">Strength of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink><br /><searchLink fieldCode="DE" term="%22Performance+technology%22">Performance technology</searchLink><br /><searchLink fieldCode="DE" term="%22Optical+quality+control%22">Optical quality control</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Ceramic column grid array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short-term and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected nondestructively, and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short- and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27 × 27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects was continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable as the number of thermal cycles increases. This paper will describe the experimental test results of CCGA testing under extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at the 137th thermal cycle and 63.2% failures of daisy chains have occurred by about 664 thermal cycles. The shape parameter extracted from the Weibull plot was about 1.47, which indicates the failures were related to failures that occurred during the flat region or useful life region of the standard bathtub curve. Based on this experimental test data, one can use the CCGAs for the temperature range studied for ∼100 thermal cycles (ΔT = 310°C, 5°C/minute, and 15 mm dwell) with a high degree of confidence for high reliability space and other applications. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.4071/1551-4897-7.1.16 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 16 Subjects: – SubjectFull: Electronics packaging Type: general – SubjectFull: Ceramic superconductors Type: general – SubjectFull: Integrated circuit interconnections Type: general – SubjectFull: Astronautical instruments Type: general – SubjectFull: Microprocessors Type: general – SubjectFull: Strength of materials Type: general – SubjectFull: Solder & soldering Type: general – SubjectFull: Performance technology Type: general – SubjectFull: Optical quality control Type: general Titles: – TitleFull: Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ramesham, Rajeshuni IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 03 Text: 2010 1st Quarter Type: published Y: 2010 Identifiers: – Type: issn-print Value: 15514897 Numbering: – Type: volume Value: 7 – Type: issue Value: 1 Titles: – TitleFull: Journal of Microelectronic & Electronic Packaging Type: main |
| ResultId | 1 |
