APA (7th ed.) Citation

Coetsier, C., Testa, F., Carretier, E., Ennahali, M., Laborie, B., Mouton-arnaud, C., . . . Moulin, P. (2011). Static dissolution rate of tungsten film versus chemical adjustments of a reused slurry for chemical mechanical polishing. Applied Surface Science, 257(14), 6163. https://doi.org/10.1016/j.apsusc.2011.02.023

Chicago Style (17th ed.) Citation

Coetsier, C.M, F. Testa, E. Carretier, M. Ennahali, B. Laborie, C. Mouton-arnaud, O. Fluchere, and P. Moulin. "Static Dissolution Rate of Tungsten Film Versus Chemical Adjustments of a Reused Slurry for Chemical Mechanical Polishing." Applied Surface Science 257, no. 14 (2011): 6163. https://doi.org/10.1016/j.apsusc.2011.02.023.

MLA (9th ed.) Citation

Coetsier, C.M, et al. "Static Dissolution Rate of Tungsten Film Versus Chemical Adjustments of a Reused Slurry for Chemical Mechanical Polishing." Applied Surface Science, vol. 257, no. 14, 2011, p. 6163, https://doi.org/10.1016/j.apsusc.2011.02.023.