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In situ optical inspection of electrochemical migration during THB tests.

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Title: In situ optical inspection of electrochemical migration during THB tests.
Authors: Medgyes, Bálint1 medgyes@ett.bme.hu, Illés, Balázs1, Berényi, Richárd1, Harsányi, Gábor1
Source: Journal of Materials Science: Materials in Electronics. Jun2011, Vol. 22 Issue 6, p694-700. 7p.
Subjects: Optical quality control, Condensation, Dendritic crystals, Water immersion, Silver, Copper, Dew point, Electric insulators & insulation
Abstract: In order to get more information about the process of electrochemical migration (ECM), a novel in situ optical inspection system was developed and tested. The optical inspection system is applicable for real time in situ investigation to observe water condensation and dendrite growth during Thermal Humidity Bias (THB) tests. In this paper, a real time observation of water condensation and dendrite growth is studied on immersion silver (iAg), bare copper (Cu) and galvanic tin (gSn) interdigital (double comb) patterns prepared on FR4 substrate during Dew Point THB test. The real time in situ optical investigations were verified by real time voltage measurements, which are presented in the paper as well. The result shows that the water condensation mainly starts on the metal surface, which is an unexpected phenomenon since the preliminary condition of ECM is the presence of a continuous moisture film between the metallization stripes, e.g. on the surface of the insulation board material. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: In situ optical inspection of electrochemical migration during THB tests.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Jun2011, Vol. 22 Issue 6, p694-700. 7p.
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  Data: <searchLink fieldCode="DE" term="%22Optical+quality+control%22">Optical quality control</searchLink><br /><searchLink fieldCode="DE" term="%22Condensation%22">Condensation</searchLink><br /><searchLink fieldCode="DE" term="%22Dendritic+crystals%22">Dendritic crystals</searchLink><br /><searchLink fieldCode="DE" term="%22Water+immersion%22">Water immersion</searchLink><br /><searchLink fieldCode="DE" term="%22Silver%22">Silver</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Dew+point%22">Dew point</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+insulators+%26+insulation%22">Electric insulators & insulation</searchLink>
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  Data: In order to get more information about the process of electrochemical migration (ECM), a novel in situ optical inspection system was developed and tested. The optical inspection system is applicable for real time in situ investigation to observe water condensation and dendrite growth during Thermal Humidity Bias (THB) tests. In this paper, a real time observation of water condensation and dendrite growth is studied on immersion silver (iAg), bare copper (Cu) and galvanic tin (gSn) interdigital (double comb) patterns prepared on FR4 substrate during Dew Point THB test. The real time in situ optical investigations were verified by real time voltage measurements, which are presented in the paper as well. The result shows that the water condensation mainly starts on the metal surface, which is an unexpected phenomenon since the preliminary condition of ECM is the presence of a continuous moisture film between the metallization stripes, e.g. on the surface of the insulation board material. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1007/s10854-010-0198-4
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      – Code: eng
        Text: English
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        PageCount: 7
        StartPage: 694
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      – SubjectFull: Optical quality control
        Type: general
      – SubjectFull: Condensation
        Type: general
      – SubjectFull: Dendritic crystals
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      – SubjectFull: Water immersion
        Type: general
      – SubjectFull: Silver
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      – SubjectFull: Copper
        Type: general
      – SubjectFull: Dew point
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      – SubjectFull: Electric insulators & insulation
        Type: general
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      – TitleFull: In situ optical inspection of electrochemical migration during THB tests.
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            NameFull: Illés, Balázs
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            NameFull: Berényi, Richárd
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            NameFull: Harsányi, Gábor
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              Text: Jun2011
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              Y: 2011
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