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Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission.

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Bibliographic Details
Title: Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission.
Authors: Song, Jeong Hwan1, Rensing, Marc2, Daunt, Chris L. L. M.2, O'Brien, Peter2, Peters, Frank H.2
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. Jun2011, Vol. 1 Issue 6, p975-980. 6p.
Subjects: Electronic modulation, Semiconductor diodes, Electric lines, Performance evaluation, Electronic packaging, Strip transmission lines, Electric impedance
Abstract: A directly modulated laser diode module with over 10 Gb/s transmission and its performance, packaging process, and manufacturability are presented. The butterfly package consists of a V-connector, heat sink, and L-shaped microstrip line (MSL) which includes an integrated impedance matching resistor. The optical system consists of a 1.3-\mum distributed feedback laser and a micro lens with isolator. A large modulation bandwidth of up to 15 GHz was obtained, and the eye diagram for 10 Gb/s modulation was clearly visible. Importantly, using an L-shaped MSL with integrated impedance matching resistor design, the module design is significantly simplified and can provide flexibility to insert various optical coupling systems. Moreover, since the laser was mounted directly on Kovar heat sink, optical output power reduction by thermal effects was 1 dB up to 50^\circC without active cooling. As a result of the simplified module configuration with flexibility, the module packaging process may be highly efficient for mass production. [ABSTRACT FROM PUBLISHER]
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Database: Engineering Source
Description
Abstract:A directly modulated laser diode module with over 10 Gb/s transmission and its performance, packaging process, and manufacturability are presented. The butterfly package consists of a V-connector, heat sink, and L-shaped microstrip line (MSL) which includes an integrated impedance matching resistor. The optical system consists of a 1.3-\mum distributed feedback laser and a micro lens with isolator. A large modulation bandwidth of up to 15 GHz was obtained, and the eye diagram for 10 Gb/s modulation was clearly visible. Importantly, using an L-shaped MSL with integrated impedance matching resistor design, the module design is significantly simplified and can provide flexibility to insert various optical coupling systems. Moreover, since the laser was mounted directly on Kovar heat sink, optical output power reduction by thermal effects was 1 dB up to 50^\circC without active cooling. As a result of the simplified module configuration with flexibility, the module packaging process may be highly efficient for mass production. [ABSTRACT FROM PUBLISHER]
ISSN:21563950
DOI:10.1109/TCPMT.2011.2129572