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Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission.

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Title: Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission.
Authors: Song, Jeong Hwan1, Rensing, Marc2, Daunt, Chris L. L. M.2, O'Brien, Peter2, Peters, Frank H.2
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. Jun2011, Vol. 1 Issue 6, p975-980. 6p.
Subjects: Electronic modulation, Semiconductor diodes, Electric lines, Performance evaluation, Electronic packaging, Strip transmission lines, Electric impedance
Abstract: A directly modulated laser diode module with over 10 Gb/s transmission and its performance, packaging process, and manufacturability are presented. The butterfly package consists of a V-connector, heat sink, and L-shaped microstrip line (MSL) which includes an integrated impedance matching resistor. The optical system consists of a 1.3-\mum distributed feedback laser and a micro lens with isolator. A large modulation bandwidth of up to 15 GHz was obtained, and the eye diagram for 10 Gb/s modulation was clearly visible. Importantly, using an L-shaped MSL with integrated impedance matching resistor design, the module design is significantly simplified and can provide flexibility to insert various optical coupling systems. Moreover, since the laser was mounted directly on Kovar heat sink, optical output power reduction by thermal effects was 1 dB up to 50^\circC without active cooling. As a result of the simplified module configuration with flexibility, the module packaging process may be highly efficient for mass production. [ABSTRACT FROM PUBLISHER]
Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 69665481
AccessLevel: 6
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  Data: Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission.
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  Data: <searchLink fieldCode="AR" term="%22Song%2C+Jeong+Hwan%22">Song, Jeong Hwan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Rensing%2C+Marc%22">Rensing, Marc</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Daunt%2C+Chris+L%2E+L%2E+M%2E%22">Daunt, Chris L. L. M.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22O'Brien%2C+Peter%22">O'Brien, Peter</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Peters%2C+Frank+H%2E%22">Peters, Frank H.</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="DE" term="%22Electronic+modulation%22">Electronic modulation</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+diodes%22">Semiconductor diodes</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+lines%22">Electric lines</searchLink><br /><searchLink fieldCode="DE" term="%22Performance+evaluation%22">Performance evaluation</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Strip+transmission+lines%22">Strip transmission lines</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+impedance%22">Electric impedance</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: A directly modulated laser diode module with over 10 Gb/s transmission and its performance, packaging process, and manufacturability are presented. The butterfly package consists of a V-connector, heat sink, and L-shaped microstrip line (MSL) which includes an integrated impedance matching resistor. The optical system consists of a 1.3-\mum distributed feedback laser and a micro lens with isolator. A large modulation bandwidth of up to 15 GHz was obtained, and the eye diagram for 10 Gb/s modulation was clearly visible. Importantly, using an L-shaped MSL with integrated impedance matching resistor design, the module design is significantly simplified and can provide flexibility to insert various optical coupling systems. Moreover, since the laser was mounted directly on Kovar heat sink, optical output power reduction by thermal effects was 1 dB up to 50^\circC without active cooling. As a result of the simplified module configuration with flexibility, the module packaging process may be highly efficient for mass production. [ABSTRACT FROM PUBLISHER]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.1109/TCPMT.2011.2129572
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      – Code: eng
        Text: English
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        PageCount: 6
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      – SubjectFull: Electronic modulation
        Type: general
      – SubjectFull: Semiconductor diodes
        Type: general
      – SubjectFull: Electric lines
        Type: general
      – SubjectFull: Performance evaluation
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      – SubjectFull: Electronic packaging
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      – SubjectFull: Strip transmission lines
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      – SubjectFull: Electric impedance
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      – TitleFull: Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission.
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            NameFull: Song, Jeong Hwan
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            NameFull: Rensing, Marc
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              Text: Jun2011
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              Y: 2011
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