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Improving solvent-based self-healing materials through shape memory alloys

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Title: Improving solvent-based self-healing materials through shape memory alloys
Authors: Neuser, S.1 sam.neuser@epfl.ch, Michaud, V.1, White, S.R.2
Source: Polymer. Jan2012, Vol. 53 Issue 2, p370-378. 9p.
Subjects: Self-healing materials, Shape memory alloys, Epoxy resins, Phenylacetates, Heating, Thickness measurement, Diffusion, Glass transition temperature
Abstract: Abstract: Healing of epoxy resins can be accomplished using a combination of embedded ethyl phenylacetate (EPA) solvent loaded capsules and shape memory alloy (SMA) wires. Upon crack formation, the EPA solvent diffuses in the resin and induces swelling which tends to close the crack, while the SMA wires upon heating reduce the crack gap and foster residual epoxy cure. The kinetics of EPA diffusion in the epoxy matrix were measured so as to evaluate the swelling thickness versus time, and concentration at saturation. The largest healable crack gap was found to be 30 μm after 24 h. EPA solvent was shown to lower the curing reaction kinetics and the glass transition temperature (Tg ) of the epoxy, as well as its stiffness and strength. Healing efficiency was assessed using long-groove tapered double cantilever beam (TDCB) test samples, with embedded SMA wires across the crack plane. The healing efficiency greatly improved when the crack gap was reduced to 30 μm, from 24% for samples without SMA wires to 78% for samples with SMA wires activated according to an optimized scenario. [Copyright &y& Elsevier]
Copyright of Polymer is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 70389832
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Improving solvent-based self-healing materials through shape memory alloys
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  Data: <searchLink fieldCode="AR" term="%22Neuser%2C+S%2E%22">Neuser, S.</searchLink><relatesTo>1</relatesTo><i> sam.neuser@epfl.ch</i><br /><searchLink fieldCode="AR" term="%22Michaud%2C+V%2E%22">Michaud, V.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22White%2C+S%2ER%2E%22">White, S.R.</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Polymer%22">Polymer</searchLink>. Jan2012, Vol. 53 Issue 2, p370-378. 9p.
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  Data: <searchLink fieldCode="DE" term="%22Self-healing+materials%22">Self-healing materials</searchLink><br /><searchLink fieldCode="DE" term="%22Shape+memory+alloys%22">Shape memory alloys</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Phenylacetates%22">Phenylacetates</searchLink><br /><searchLink fieldCode="DE" term="%22Heating%22">Heating</searchLink><br /><searchLink fieldCode="DE" term="%22Thickness+measurement%22">Thickness measurement</searchLink><br /><searchLink fieldCode="DE" term="%22Diffusion%22">Diffusion</searchLink><br /><searchLink fieldCode="DE" term="%22Glass+transition+temperature%22">Glass transition temperature</searchLink>
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  Data: Abstract: Healing of epoxy resins can be accomplished using a combination of embedded ethyl phenylacetate (EPA) solvent loaded capsules and shape memory alloy (SMA) wires. Upon crack formation, the EPA solvent diffuses in the resin and induces swelling which tends to close the crack, while the SMA wires upon heating reduce the crack gap and foster residual epoxy cure. The kinetics of EPA diffusion in the epoxy matrix were measured so as to evaluate the swelling thickness versus time, and concentration at saturation. The largest healable crack gap was found to be 30 μm after 24 h. EPA solvent was shown to lower the curing reaction kinetics and the glass transition temperature (Tg ) of the epoxy, as well as its stiffness and strength. Healing efficiency was assessed using long-groove tapered double cantilever beam (TDCB) test samples, with embedded SMA wires across the crack plane. The healing efficiency greatly improved when the crack gap was reduced to 30 μm, from 24% for samples without SMA wires to 78% for samples with SMA wires activated according to an optimized scenario. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: <i>Copyright of Polymer is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.1016/j.polymer.2011.12.020
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 9
        StartPage: 370
    Subjects:
      – SubjectFull: Self-healing materials
        Type: general
      – SubjectFull: Shape memory alloys
        Type: general
      – SubjectFull: Epoxy resins
        Type: general
      – SubjectFull: Phenylacetates
        Type: general
      – SubjectFull: Heating
        Type: general
      – SubjectFull: Thickness measurement
        Type: general
      – SubjectFull: Diffusion
        Type: general
      – SubjectFull: Glass transition temperature
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      – TitleFull: Improving solvent-based self-healing materials through shape memory alloys
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            NameFull: Neuser, S.
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            NameFull: Michaud, V.
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            NameFull: White, S.R.
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              M: 01
              Text: Jan2012
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              Y: 2012
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