Improvement in performance and reliability with CF4 plasma pretreatment on the buffer oxide layer for low-temperature polysilicon thin-film transistor.

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Bibliographic Details
Title: Improvement in performance and reliability with CF4 plasma pretreatment on the buffer oxide layer for low-temperature polysilicon thin-film transistor.
Authors: Ching-Lin Fan1,2 clfan@mail.ntust.edu.tw, Yi-Yan Lin1, Chun-Chieh Yang1
Source: Semiconductor Science & Technology. Mar2012, Vol. 27 Issue 3, p035005-035005. 1p. 1 Diagram, 2 Charts, 6 Graphs.
Subjects: Silicon, Thin film transistors, Low temperatures, Plasma gases, Oxides, Fluorine, Threshold voltage, Field-effect transistors
Abstract: This study applies CF4 plasma pretreatment to a buffer oxide layer to improve the performance of low-temperature polysilicon thin-film transistors (LTPS TFTs). Results show that the fluorine atoms piled up at the interface between the bulk channel and buffer oxide layer and accumulated in the bulk channel. The reduction of the trap states density by fluorine passivation can improve the electrical characteristics of the LTPS TFTs. It is found that the threshold voltage reduced from 4.32 to 3.03 V and the field-effect mobility increased from 29.71 to 45.65 cm2 V[?]1 S[?]1. In addition, the on current degradation and threshold voltage shift after stressing were significantly improved about 31% and 70%, respectively. We believe that the proposed CF4 plasma pretreatment on the buffer oxide layer can passivate the trap states and avoid the plasma induced damage on the polysilicon channel surface, resulting in the improvement in performance and reliability for LTPS-TFT mass production application on AMOLED displays with critical reliability requirement. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
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