APA (7th ed.) Citation

Han, W., Rensing, M., O'Brien, P., & Peters, F. H. (2011). Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model. Journal of Electronic Packaging, 133(4), 44502.1. https://doi.org/10.1115/1.4005292

Chicago Style (17th ed.) Citation

Han, Wei, Marc Rensing, Peter O'Brien, and Frank H. Peters. "Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model." Journal of Electronic Packaging 133, no. 4 (2011): 44502.1. https://doi.org/10.1115/1.4005292.

MLA (9th ed.) Citation

Han, Wei, et al. "Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model." Journal of Electronic Packaging, vol. 133, no. 4, 2011, p. 44502.1, https://doi.org/10.1115/1.4005292.