Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model.
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| Title: | Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model. |
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| Authors: | Wei Han1, Rensing, Marc1, O'Brien, Peter1, Peters, Frank H.1,2 |
| Source: | Journal of Electronic Packaging. Dec2011, Vol. 133 Issue 4, p44502.1-44502.4. 4p. |
| Subjects: | Electromagnetism, Lasers, Optoelectronics, Simulation methods & models, Bandwidths |
| Abstract: | In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector and optoelectronic subsystem. By carefully optimizing the package structure, the simulation results show that the insertion loss of the proposed module is less than 1 dB up to 40 GHz. Then, a DML module is packaged and measured based on the optimized package scheme. A resonance free bandwidth of approximately 20 GHz is obtained with a 3dB bandwidth of about 15GHz. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 71742434 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Wei+Han%22">Wei Han</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Rensing%2C+Marc%22">Rensing, Marc</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22O'Brien%2C+Peter%22">O'Brien, Peter</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Peters%2C+Frank+H%2E%22">Peters, Frank H.</searchLink><relatesTo>1,2</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>. Dec2011, Vol. 133 Issue 4, p44502.1-44502.4. 4p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Electromagnetism%22">Electromagnetism</searchLink><br /><searchLink fieldCode="DE" term="%22Lasers%22">Lasers</searchLink><br /><searchLink fieldCode="DE" term="%22Optoelectronics%22">Optoelectronics</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+methods+%26+models%22">Simulation methods & models</searchLink><br /><searchLink fieldCode="DE" term="%22Bandwidths%22">Bandwidths</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector and optoelectronic subsystem. By carefully optimizing the package structure, the simulation results show that the insertion loss of the proposed module is less than 1 dB up to 40 GHz. Then, a DML module is packaged and measured based on the optimized package scheme. A resonance free bandwidth of approximately 20 GHz is obtained with a 3dB bandwidth of about 15GHz. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1115/1.4005292 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 4 StartPage: 44502.1 Subjects: – SubjectFull: Electromagnetism Type: general – SubjectFull: Lasers Type: general – SubjectFull: Optoelectronics Type: general – SubjectFull: Simulation methods & models Type: general – SubjectFull: Bandwidths Type: general Titles: – TitleFull: Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Wei Han – PersonEntity: Name: NameFull: Rensing, Marc – PersonEntity: Name: NameFull: O'Brien, Peter – PersonEntity: Name: NameFull: Peters, Frank H. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2011 Type: published Y: 2011 Identifiers: – Type: issn-print Value: 10437398 Numbering: – Type: volume Value: 133 – Type: issue Value: 4 Titles: – TitleFull: Journal of Electronic Packaging Type: main |
| ResultId | 1 |
