View in EDS

State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer

Saved in:
Bibliographic Details
Title: State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer
Authors: Zhou, L.B. lbzhou@dse.ibaraki.ac.jp, Eda, H.1, Shimizu, J.1
Source: Journal of Materials Processing Technology. Oct2002, Vol. 129 Issue 1-3, p34. 7p.
Subjects: Semiconductor wafers, Finishes & finishing, Surface roughness
Abstract: This research has successfully developed an advanced manufacturing system for φ300 mm silicon wafer, using fixed abrasive instead of conventional free slurry, to provide a totally integrated solution for achieving a surface roughness of Ra<1 nm (Ry<5–6 nm) and a global flatness of <0.2 μm/φ300 mm. In addition to a high throughput rate, this system significantly reduces the total energy consumption by 70%, compared with the current process used for φ200 mm Si wafer. This paper describes the principle of material removal, state-of-the-art technologies and kinematical analysis for the one-stop finishing of φ300 mm Si wafer by fixed abrasive process. [Copyright &y& Elsevier]
Copyright of Journal of Materials Processing Technology is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 7884545
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer
– Name: Author
  Label: Authors
  Group: Au
  Data: &lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Zhou%2C+L%2EB%2E%22&quot;&gt;Zhou, L.B.&lt;/searchLink&gt;&lt;i&gt; lbzhou@dse.ibaraki.ac.jp&lt;/i&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Eda%2C+H%2E%22&quot;&gt;Eda, H.&lt;/searchLink&gt;&lt;relatesTo&gt;1&lt;/relatesTo&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Shimizu%2C+J%2E%22&quot;&gt;Shimizu, J.&lt;/searchLink&gt;&lt;relatesTo&gt;1&lt;/relatesTo&gt;
– Name: TitleSource
  Label: Source
  Group: Src
  Data: &lt;searchLink fieldCode=&quot;JN&quot; term=&quot;%22Journal+of+Materials+Processing+Technology%22&quot;&gt;Journal of Materials Processing Technology&lt;/searchLink&gt;. Oct2002, Vol. 129 Issue 1-3, p34. 7p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: &lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Semiconductor+wafers%22&quot;&gt;Semiconductor wafers&lt;/searchLink&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Finishes+%26+finishing%22&quot;&gt;Finishes &amp; finishing&lt;/searchLink&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;DE&quot; term=&quot;%22Surface+roughness%22&quot;&gt;Surface roughness&lt;/searchLink&gt;
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: This research has successfully developed an advanced manufacturing system for φ300 mm silicon wafer, using fixed abrasive instead of conventional free slurry, to provide a totally integrated solution for achieving a surface roughness of &lt;F&gt;Ra&lt;1&lt;/F&gt; nm (&lt;F&gt;Ry&lt;5–6&lt;/F&gt; nm) and a global flatness of &lt;0.2 μm/φ300 mm. In addition to a high throughput rate, this system significantly reduces the total energy consumption by 70%, compared with the current process used for φ200 mm Si wafer. This paper describes the principle of material removal, state-of-the-art technologies and kinematical analysis for the one-stop finishing of φ300 mm Si wafer by fixed abrasive process. [Copyright &amp;y&amp; Elsevier]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: &lt;i&gt;Copyright of Journal of Materials Processing Technology is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder&#39;s express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.&lt;/i&gt; (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=7884545
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/S0924-0136(02)00571-X
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 7
        StartPage: 34
    Subjects:
      – SubjectFull: Semiconductor wafers
        Type: general
      – SubjectFull: Finishes & finishing
        Type: general
      – SubjectFull: Surface roughness
        Type: general
    Titles:
      – TitleFull: State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zhou, L.B.
      – PersonEntity:
          Name:
            NameFull: Eda, H.
      – PersonEntity:
          Name:
            NameFull: Shimizu, J.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 11
              M: 10
              Text: Oct2002
              Type: published
              Y: 2002
          Identifiers:
            – Type: issn-print
              Value: 09240136
          Numbering:
            – Type: volume
              Value: 129
            – Type: issue
              Value: 1-3
          Titles:
            – TitleFull: Journal of Materials Processing Technology
              Type: main
ResultId 1