View in EDS

On the thermal cooling of central processing unit of the PCs with vapor chamber

Saved in:
Bibliographic Details
Title: On the thermal cooling of central processing unit of the PCs with vapor chamber
Authors: Naphon, Paisarn1 paisarnn@swu.ac.th, Wongwises, Somchai2, Wiriyasart, Songkran1
Source: International Communications in Heat & Mass Transfer. Oct2012, Vol. 39 Issue 8, p1165-1168. 4p.
Subjects: Central processing units, Computer cooling, Personal computers, Experiments, Working fluids, Temperature effect, Energy consumption
Abstract: Abstract: An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance. [Copyright &y& Elsevier]
Copyright of International Communications in Heat & Mass Transfer is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Description
Abstract:Abstract: An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance. [Copyright &y& Elsevier]
ISSN:07351933
DOI:10.1016/j.icheatmasstransfer.2012.07.013