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On the thermal cooling of central processing unit of the PCs with vapor chamber

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Title: On the thermal cooling of central processing unit of the PCs with vapor chamber
Authors: Naphon, Paisarn1 paisarnn@swu.ac.th, Wongwises, Somchai2, Wiriyasart, Songkran1
Source: International Communications in Heat & Mass Transfer. Oct2012, Vol. 39 Issue 8, p1165-1168. 4p.
Subjects: Central processing units, Computer cooling, Personal computers, Experiments, Working fluids, Temperature effect, Energy consumption
Abstract: Abstract: An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance. [Copyright &y& Elsevier]
Copyright of International Communications in Heat & Mass Transfer is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 79337641
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: On the thermal cooling of central processing unit of the PCs with vapor chamber
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  Data: <searchLink fieldCode="AR" term="%22Naphon%2C+Paisarn%22">Naphon, Paisarn</searchLink><relatesTo>1</relatesTo><i> paisarnn@swu.ac.th</i><br /><searchLink fieldCode="AR" term="%22Wongwises%2C+Somchai%22">Wongwises, Somchai</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Wiriyasart%2C+Songkran%22">Wiriyasart, Songkran</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22International+Communications+in+Heat+%26+Mass+Transfer%22">International Communications in Heat & Mass Transfer</searchLink>. Oct2012, Vol. 39 Issue 8, p1165-1168. 4p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Central+processing+units%22">Central processing units</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+cooling%22">Computer cooling</searchLink><br /><searchLink fieldCode="DE" term="%22Personal+computers%22">Personal computers</searchLink><br /><searchLink fieldCode="DE" term="%22Experiments%22">Experiments</searchLink><br /><searchLink fieldCode="DE" term="%22Working+fluids%22">Working fluids</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+effect%22">Temperature effect</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+consumption%22">Energy consumption</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: Abstract: An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of International Communications in Heat & Mass Transfer is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.icheatmasstransfer.2012.07.013
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      – Code: eng
        Text: English
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        PageCount: 4
        StartPage: 1165
    Subjects:
      – SubjectFull: Central processing units
        Type: general
      – SubjectFull: Computer cooling
        Type: general
      – SubjectFull: Personal computers
        Type: general
      – SubjectFull: Experiments
        Type: general
      – SubjectFull: Working fluids
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      – SubjectFull: Temperature effect
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      – SubjectFull: Energy consumption
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      – TitleFull: On the thermal cooling of central processing unit of the PCs with vapor chamber
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              M: 10
              Text: Oct2012
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