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Advanced glass etching method exhibiting the controllable etch stop using metal etchant.

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Title: Advanced glass etching method exhibiting the controllable etch stop using metal etchant.
Authors: Hyobong Ryu1, Pan Kyeom Kim2, Geunbae Lim1,3 limmems@postech.ac.kr
Source: Journal of Micromechanics & Microengineering. Dec2012, Vol. 22 Issue 12, p1-5. 5p.
Subjects: Glass etching, Etching reagents, Nanoelectromechanical systems, Hydrogen fluoride, Diffusion, Nanostructured materials, Thickness measurement
Abstract: The limitations of conventional glass etching methods are a bottleneck in the further development of glass as a substrate, which is critically important in micro- and nanoelectromechanical systems. In this paper, we describe a new wet etching method for Pyrex glass using a metal etchant. An aluminum pattern is deposited on the Pyrex and then subjected to thermal and electrostatically induced interdiffusion to form an aluminum-rich layer of controllable thickness in the glass, which can then be etched with an aluminum etchant. Because the underlying glass acts as an etch stop, no etching mask is required and the etching depth is effectively controlled by the electric field strength. This method can be used for fabricating glass nanochannels and nanodepth structures, and also in processes incompatible with hydrogen fluoride. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Micromechanics & Microengineering is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 83850809
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Advanced glass etching method exhibiting the controllable etch stop using metal etchant.
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  Data: <searchLink fieldCode="AR" term="%22Hyobong+Ryu%22">Hyobong Ryu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Pan+Kyeom+Kim%22">Pan Kyeom Kim</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Geunbae+Lim%22">Geunbae Lim</searchLink><relatesTo>1,3</relatesTo><i> limmems@postech.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Micromechanics+%26+Microengineering%22">Journal of Micromechanics & Microengineering</searchLink>. Dec2012, Vol. 22 Issue 12, p1-5. 5p.
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  Data: <searchLink fieldCode="DE" term="%22Glass+etching%22">Glass etching</searchLink><br /><searchLink fieldCode="DE" term="%22Etching+reagents%22">Etching reagents</searchLink><br /><searchLink fieldCode="DE" term="%22Nanoelectromechanical+systems%22">Nanoelectromechanical systems</searchLink><br /><searchLink fieldCode="DE" term="%22Hydrogen+fluoride%22">Hydrogen fluoride</searchLink><br /><searchLink fieldCode="DE" term="%22Diffusion%22">Diffusion</searchLink><br /><searchLink fieldCode="DE" term="%22Nanostructured+materials%22">Nanostructured materials</searchLink><br /><searchLink fieldCode="DE" term="%22Thickness+measurement%22">Thickness measurement</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: The limitations of conventional glass etching methods are a bottleneck in the further development of glass as a substrate, which is critically important in micro- and nanoelectromechanical systems. In this paper, we describe a new wet etching method for Pyrex glass using a metal etchant. An aluminum pattern is deposited on the Pyrex and then subjected to thermal and electrostatically induced interdiffusion to form an aluminum-rich layer of controllable thickness in the glass, which can then be etched with an aluminum etchant. Because the underlying glass acts as an etch stop, no etching mask is required and the etching depth is effectively controlled by the electric field strength. This method can be used for fabricating glass nanochannels and nanodepth structures, and also in processes incompatible with hydrogen fluoride. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Micromechanics & Microengineering is the property of IOP Publishing and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1088/0960-1317/22/12/125010
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      – Code: eng
        Text: English
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        PageCount: 5
        StartPage: 1
    Subjects:
      – SubjectFull: Glass etching
        Type: general
      – SubjectFull: Etching reagents
        Type: general
      – SubjectFull: Nanoelectromechanical systems
        Type: general
      – SubjectFull: Hydrogen fluoride
        Type: general
      – SubjectFull: Diffusion
        Type: general
      – SubjectFull: Nanostructured materials
        Type: general
      – SubjectFull: Thickness measurement
        Type: general
    Titles:
      – TitleFull: Advanced glass etching method exhibiting the controllable etch stop using metal etchant.
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          Name:
            NameFull: Hyobong Ryu
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            NameFull: Pan Kyeom Kim
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            NameFull: Geunbae Lim
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            – D: 01
              M: 12
              Text: Dec2012
              Type: published
              Y: 2012
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              Value: 22
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              Value: 12
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            – TitleFull: Journal of Micromechanics & Microengineering
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