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IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

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Title: IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
Authors: Chen, Wen-Hwa1 whchen@pme.nthu.edu.tw, Yu, Ching-Feng1, Cheng, Hsien-Chie2,3 hccheng@fcu.edu.tw, Tsai, Yu-min1, Lu, Su-Tsai4
Source: Microelectronics Reliability. Jan2013, Vol. 53 Issue 1, p30-40. 11p.
Subjects: Intermetallic compounds, Morphology, Geometry, Thermocycling, Integrated circuits, Three-dimensional integrated circuits, Thermoelasticity
Abstract: Abstract: The study aims at assessing the growth reaction of the Ni3Sn4 intermetallic compound (IMC) during bonding process and its dependences on the thermal-cycling reliability of the Cu/Ni/SnAg micro-joints of an advanced 3D chip stacking package under accelerated thermal cycling (ATC) loading. The growth reaction of the IMC during bonding process is also predicted through experiment and classical diffusion theory, and the relation between the IMC thickness and bonding process temperature and time is derived according to the predicted activation energy of the chemical reaction between Sn and Ni by experiment. Moreover, the micro-joint reliability prediction is made using finite element (FE) analysis incorporated with an empirical Coffin–Manson fatigue life prediction model and also ATC experimental test. To facilitate the FE modeling, the temperature-dependent thermoelastic properties of both single crystal and polycrystalline Ni3Sn4 IMC are characterized through molecular dynamics simulation and the Voigt–Reuss bound and Voigt–Reuss–Hill approximation. Results show that monoclinic single crystal Ni3Sn4 reveals a high elastic anisotropy or direction dependence of elasticity. The diffusion reaction of Sn and Ni exhibits that a longer bonding process time and a higher bonding temperature could not only increase the IMC thickness but also vary its surface morphology. In addition, the thermal–mechanical performance of the micro-joints is strongly affected by the geometry and material of IMC layer, where IMC with a thicker thickness, a less Young’s modulus, a smaller CTE and even a more rounded surface morphology can better the reliability. [Copyright &y& Elsevier]
Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 84746668
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PubType: Academic Journal
PubTypeId: academicJournal
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  Label: Title
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  Data: IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
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  Data: <searchLink fieldCode="AR" term="%22Chen%2C+Wen-Hwa%22">Chen, Wen-Hwa</searchLink><relatesTo>1</relatesTo><i> whchen@pme.nthu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Yu%2C+Ching-Feng%22">Yu, Ching-Feng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Cheng%2C+Hsien-Chie%22">Cheng, Hsien-Chie</searchLink><relatesTo>2,3</relatesTo><i> hccheng@fcu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Tsai%2C+Yu-min%22">Tsai, Yu-min</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Lu%2C+Su-Tsai%22">Lu, Su-Tsai</searchLink><relatesTo>4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Jan2013, Vol. 53 Issue 1, p30-40. 11p.
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  Data: <searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Morphology%22">Morphology</searchLink><br /><searchLink fieldCode="DE" term="%22Geometry%22">Geometry</searchLink><br /><searchLink fieldCode="DE" term="%22Thermocycling%22">Thermocycling</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Three-dimensional+integrated+circuits%22">Three-dimensional integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Thermoelasticity%22">Thermoelasticity</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Abstract: The study aims at assessing the growth reaction of the Ni3Sn4 intermetallic compound (IMC) during bonding process and its dependences on the thermal-cycling reliability of the Cu/Ni/SnAg micro-joints of an advanced 3D chip stacking package under accelerated thermal cycling (ATC) loading. The growth reaction of the IMC during bonding process is also predicted through experiment and classical diffusion theory, and the relation between the IMC thickness and bonding process temperature and time is derived according to the predicted activation energy of the chemical reaction between Sn and Ni by experiment. Moreover, the micro-joint reliability prediction is made using finite element (FE) analysis incorporated with an empirical Coffin–Manson fatigue life prediction model and also ATC experimental test. To facilitate the FE modeling, the temperature-dependent thermoelastic properties of both single crystal and polycrystalline Ni3Sn4 IMC are characterized through molecular dynamics simulation and the Voigt–Reuss bound and Voigt–Reuss–Hill approximation. Results show that monoclinic single crystal Ni3Sn4 reveals a high elastic anisotropy or direction dependence of elasticity. The diffusion reaction of Sn and Ni exhibits that a longer bonding process time and a higher bonding temperature could not only increase the IMC thickness but also vary its surface morphology. In addition, the thermal–mechanical performance of the micro-joints is strongly affected by the geometry and material of IMC layer, where IMC with a thicker thickness, a less Young’s modulus, a smaller CTE and even a more rounded surface morphology can better the reliability. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.microrel.2012.06.146
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 30
    Subjects:
      – SubjectFull: Intermetallic compounds
        Type: general
      – SubjectFull: Morphology
        Type: general
      – SubjectFull: Geometry
        Type: general
      – SubjectFull: Thermocycling
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      – SubjectFull: Integrated circuits
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      – SubjectFull: Three-dimensional integrated circuits
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      – SubjectFull: Thermoelasticity
        Type: general
    Titles:
      – TitleFull: IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
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            NameFull: Chen, Wen-Hwa
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            NameFull: Yu, Ching-Feng
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            NameFull: Cheng, Hsien-Chie
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            NameFull: Tsai, Yu-min
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            NameFull: Lu, Su-Tsai
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              Text: Jan2013
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              Y: 2013
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