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Dielectric response of various partially cured epoxy nanocomposites.

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Title: Dielectric response of various partially cured epoxy nanocomposites.
Authors: Preda, I.1, Castellon, J.1, Agnel, S.1, Couderc, H.2, Frechette, M.2, Gao, F.3, Nigmatullin, R.3, Thompson, S.3, Vaessen, A.-F.4
Source: IEEE Transactions on Dielectrics & Electrical Insulation. Apr2013, Vol. 20 Issue 2, p580-591. 12p.
Subjects: Dielectric loss, Water, Microfabrication, Epoxy insulators, Deterioration of materials, Ultrasonic waves, X-ray diffraction, Glass transition temperature, Nanocomposite materials
Abstract: Insufficient crosslinking and water uptake during fabrication or manipulation are known to affect the dielectric response of epoxies. Post thermal treatment may result in the completion of cross-linking, partial removal of water, and aging. In order to study the effect of manufacturing imprecision on dielectric response, several under-cured epoxy-based nanocomposite samples with modified nanoclay fillers were investigated. In addition, the influence of silane coupling agents and the use of ultrasonic waves on the nanoclay intercalation were also studied. The structure of the samples and the extent of cross linking were characterized using X-ray Diffraction (XRD) and Differential Scanning Calorimetry (DSC) respectively. It was found that surface silanization lead to improved clay intercalation and higher extent of intercalation/exfoliation. The influence of post thermal treatment on the dielectric response of the materials was investigated using Broadband Dielectric Spectroscopy (BDS). Once the samples were in a stable dielectric state, relaxation maps were performed. It was found that the samples with silanized nanoclay have the lowest activation energy and they also proved to be the "strongest" vitreous materials. [ABSTRACT FROM PUBLISHER]
Copyright of IEEE Transactions on Dielectrics & Electrical Insulation is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 87462661
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Dielectric response of various partially cured epoxy nanocomposites.
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  Data: <searchLink fieldCode="AR" term="%22Preda%2C+I%2E%22">Preda, I.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Castellon%2C+J%2E%22">Castellon, J.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Agnel%2C+S%2E%22">Agnel, S.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Couderc%2C+H%2E%22">Couderc, H.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Frechette%2C+M%2E%22">Frechette, M.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Gao%2C+F%2E%22">Gao, F.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Nigmatullin%2C+R%2E%22">Nigmatullin, R.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Thompson%2C+S%2E%22">Thompson, S.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Vaessen%2C+A%2E-F%2E%22">Vaessen, A.-F.</searchLink><relatesTo>4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Dielectrics+%26+Electrical+Insulation%22">IEEE Transactions on Dielectrics & Electrical Insulation</searchLink>. Apr2013, Vol. 20 Issue 2, p580-591. 12p.
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  Data: <searchLink fieldCode="DE" term="%22Dielectric+loss%22">Dielectric loss</searchLink><br /><searchLink fieldCode="DE" term="%22Water%22">Water</searchLink><br /><searchLink fieldCode="DE" term="%22Microfabrication%22">Microfabrication</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+insulators%22">Epoxy insulators</searchLink><br /><searchLink fieldCode="DE" term="%22Deterioration+of+materials%22">Deterioration of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Ultrasonic+waves%22">Ultrasonic waves</searchLink><br /><searchLink fieldCode="DE" term="%22X-ray+diffraction%22">X-ray diffraction</searchLink><br /><searchLink fieldCode="DE" term="%22Glass+transition+temperature%22">Glass transition temperature</searchLink><br /><searchLink fieldCode="DE" term="%22Nanocomposite+materials%22">Nanocomposite materials</searchLink>
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  Data: Insufficient crosslinking and water uptake during fabrication or manipulation are known to affect the dielectric response of epoxies. Post thermal treatment may result in the completion of cross-linking, partial removal of water, and aging. In order to study the effect of manufacturing imprecision on dielectric response, several under-cured epoxy-based nanocomposite samples with modified nanoclay fillers were investigated. In addition, the influence of silane coupling agents and the use of ultrasonic waves on the nanoclay intercalation were also studied. The structure of the samples and the extent of cross linking were characterized using X-ray Diffraction (XRD) and Differential Scanning Calorimetry (DSC) respectively. It was found that surface silanization lead to improved clay intercalation and higher extent of intercalation/exfoliation. The influence of post thermal treatment on the dielectric response of the materials was investigated using Broadband Dielectric Spectroscopy (BDS). Once the samples were in a stable dielectric state, relaxation maps were performed. It was found that the samples with silanized nanoclay have the lowest activation energy and they also proved to be the "strongest" vitreous materials. [ABSTRACT FROM PUBLISHER]
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  Label:
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  Data: <i>Copyright of IEEE Transactions on Dielectrics & Electrical Insulation is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1109/TDEI.2013.6508762
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 580
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      – SubjectFull: Dielectric loss
        Type: general
      – SubjectFull: Water
        Type: general
      – SubjectFull: Microfabrication
        Type: general
      – SubjectFull: Epoxy insulators
        Type: general
      – SubjectFull: Deterioration of materials
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      – SubjectFull: Ultrasonic waves
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      – SubjectFull: X-ray diffraction
        Type: general
      – SubjectFull: Glass transition temperature
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      – SubjectFull: Nanocomposite materials
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      – TitleFull: Dielectric response of various partially cured epoxy nanocomposites.
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              M: 04
              Text: Apr2013
              Type: published
              Y: 2013
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