SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING.
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| Title: | SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING. |
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| Authors: | Sung-Mao Wu1 sungmao@nuk.edu.tw, Ren-Fang Hsu1, Po-Hui Yu1 |
| Source: | Progress in Electromagnetics Research. 2013, Vol. 141, p201-217. 17p. |
| Subjects: | Electronics packaging, Technical specifications, New product development, Substrates (Materials science), Electric lines, Internet protocols, Electric interference |
| Abstract: | Since the system-level package was proposed, the electronics industry has increasingly attached importance to both directly relevant and related issues, and the scope of system-level package usage has increased. Creating more complex system-level package structures, thereby leading to the design of overall electrical effects, requires more electromagnetic simulation resources, and therefore a great deal of time in the design process. The main purpose of this paper is to analyze the effects of system-level packaging, and to establish systems-in-package in accordance with electrical specifications. Using a segmented approach, this paper also builds an overall model for designers to predict electrical characteristics, thus shortening the product development schedule. In this paper, the transmission effects of a substrate are analyzed by changing the length of the substrate transmission line, with or without a thermal ground ball and ground ring. Previously established package IP are cascaded to establish the model of the package substrate, which verifies the feasibility of the package IP. We then analyze the characteristics of the interference between chips and package using an integrated passive device, and propose a complete package equivalent circuit model. [ABSTRACT FROM AUTHOR] |
| Copyright of Progress in Electromagnetics Research is the property of Electromagnetics Academy and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 89986142 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Sung-Mao+Wu%22">Sung-Mao Wu</searchLink><relatesTo>1</relatesTo><i> sungmao@nuk.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Ren-Fang+Hsu%22">Ren-Fang Hsu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Po-Hui+Yu%22">Po-Hui Yu</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Progress+in+Electromagnetics+Research%22">Progress in Electromagnetics Research</searchLink>. 2013, Vol. 141, p201-217. 17p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Technical+specifications%22">Technical specifications</searchLink><br /><searchLink fieldCode="DE" term="%22New+product+development%22">New product development</searchLink><br /><searchLink fieldCode="DE" term="%22Substrates+%28Materials+science%29%22">Substrates (Materials science)</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+lines%22">Electric lines</searchLink><br /><searchLink fieldCode="DE" term="%22Internet+protocols%22">Internet protocols</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+interference%22">Electric interference</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Since the system-level package was proposed, the electronics industry has increasingly attached importance to both directly relevant and related issues, and the scope of system-level package usage has increased. Creating more complex system-level package structures, thereby leading to the design of overall electrical effects, requires more electromagnetic simulation resources, and therefore a great deal of time in the design process. The main purpose of this paper is to analyze the effects of system-level packaging, and to establish systems-in-package in accordance with electrical specifications. Using a segmented approach, this paper also builds an overall model for designers to predict electrical characteristics, thus shortening the product development schedule. In this paper, the transmission effects of a substrate are analyzed by changing the length of the substrate transmission line, with or without a thermal ground ball and ground ring. Previously established package IP are cascaded to establish the model of the package substrate, which verifies the feasibility of the package IP. We then analyze the characteristics of the interference between chips and package using an integrated passive device, and propose a complete package equivalent circuit model. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Progress in Electromagnetics Research is the property of Electromagnetics Academy and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.2528/pier13040214 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 17 StartPage: 201 Subjects: – SubjectFull: Electronics packaging Type: general – SubjectFull: Technical specifications Type: general – SubjectFull: New product development Type: general – SubjectFull: Substrates (Materials science) Type: general – SubjectFull: Electric lines Type: general – SubjectFull: Internet protocols Type: general – SubjectFull: Electric interference Type: general Titles: – TitleFull: SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Sung-Mao Wu – PersonEntity: Name: NameFull: Ren-Fang Hsu – PersonEntity: Name: NameFull: Po-Hui Yu IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 10 Text: 2013 Type: published Y: 2013 Identifiers: – Type: issn-print Value: 10704698 Numbering: – Type: volume Value: 141 Titles: – TitleFull: Progress in Electromagnetics Research Type: main |
| ResultId | 1 |
