APA (7th ed.) Citation

Testa, F., Coetsier, C., Carretier, E., Ennahali, M., Laborie, B., & Moulin, P. (2014). Recycling a slurry for reuse in chemical mechanical planarization of tungsten wafer: Effect of chemical adjustments and comparison between static and dynamic experiments. Microelectronic Engineering, 113, 114. https://doi.org/10.1016/j.mee.2013.07.022

Chicago Style (17th ed.) Citation

Testa, F., C. Coetsier, E. Carretier, M. Ennahali, B. Laborie, and P. Moulin. "Recycling a Slurry for Reuse in Chemical Mechanical Planarization of Tungsten Wafer: Effect of Chemical Adjustments and Comparison Between Static and Dynamic Experiments." Microelectronic Engineering 113 (2014): 114. https://doi.org/10.1016/j.mee.2013.07.022.

MLA (9th ed.) Citation

Testa, F., et al. "Recycling a Slurry for Reuse in Chemical Mechanical Planarization of Tungsten Wafer: Effect of Chemical Adjustments and Comparison Between Static and Dynamic Experiments." Microelectronic Engineering, vol. 113, 2014, p. 114, https://doi.org/10.1016/j.mee.2013.07.022.