Besnard, G., Garros, X., Nguyen, P., Andrieu, F., Reynaud, P., Van Den Daele, W., . . . Cristoloveanu, S. (2014). Reliability of ultra-thin buried oxides for multi-VT FDSOI technology. Solid-State Electronics, 97, 8. https://doi.org/10.1016/j.sse.2014.04.035
Chicago Style (17th ed.) CitationBesnard, G., et al. "Reliability of Ultra-thin Buried Oxides for Multi-VT FDSOI Technology." Solid-State Electronics 97 (2014): 8. https://doi.org/10.1016/j.sse.2014.04.035.
MLA (9th ed.) CitationBesnard, G., et al. "Reliability of Ultra-thin Buried Oxides for Multi-VT FDSOI Technology." Solid-State Electronics, vol. 97, 2014, p. 8, https://doi.org/10.1016/j.sse.2014.04.035.
Warning: These citations may not always be 100% accurate.