Fu, K., Chang, Y., Tang, Y., & Zheng, B. (2014). Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation. Journal of Materials Science: Materials in Electronics, 25(8), 3552. https://doi.org/10.1007/s10854-014-2055-3
Chicago Style (17th ed.) CitationFu, Kunkun, Yuan Chang, Youhong Tang, and Bailin Zheng. "Effect of Loading Rate on the Creep Behaviour of Epoxy Resin Insulators by Nanoindentation." Journal of Materials Science: Materials in Electronics 25, no. 8 (2014): 3552. https://doi.org/10.1007/s10854-014-2055-3.
MLA (9th ed.) CitationFu, Kunkun, et al. "Effect of Loading Rate on the Creep Behaviour of Epoxy Resin Insulators by Nanoindentation." Journal of Materials Science: Materials in Electronics, vol. 25, no. 8, 2014, p. 3552, https://doi.org/10.1007/s10854-014-2055-3.