Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation.
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| Title: | Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation. |
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| Authors: | Fu, Kunkun stone_fkk@163.com, Chang, Yuan1, Tang, Youhong2 youhong.tang@flinders.edu.au, Zheng, Bailin3 |
| Source: | Journal of Materials Science: Materials in Electronics. Aug2014, Vol. 25 Issue 8, p3552-3558. 7p. |
| Subjects: | Epoxy insulators, Nanoindentation, Creep (Materials), Mechanical loads, Deformations (Mechanics) |
| Abstract: | In the present work, the effect of loading rate on indentation creep was studied. Indentation creep tests were conducted on epoxy resin to provide creep deformation under constant load, contact creep compliance and cut-off time using a Berkovich indenter. Several loading rates, ranging from 0.25 to 6 mN/s, were used to perform the tests. The results showed that there is a strong loading rate dependence on creep response of the epoxy resin under indentation. Contact creep compliance and cut-off time decreased with increasing loading rate. In contrast, an increase in reduced modulus, hardness, displacement variation and contact creep compliance variation during the holding time was noticed. The loading rate sensitivity on creep response under indentation can be attributed to viscoelastic response prior to holding segment and strain rate effect on yield stress of the epoxy resin. This study provided an insight to understand the loading rate dependence on creep behaviour of epoxy resin under indentation. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 96939320 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Fu%2C+Kunkun%22">Fu, Kunkun</searchLink><i> stone_fkk@163.com</i><br /><searchLink fieldCode="AR" term="%22Chang%2C+Yuan%22">Chang, Yuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Tang%2C+Youhong%22">Tang, Youhong</searchLink><relatesTo>2</relatesTo><i> youhong.tang@flinders.edu.au</i><br /><searchLink fieldCode="AR" term="%22Zheng%2C+Bailin%22">Zheng, Bailin</searchLink><relatesTo>3</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Aug2014, Vol. 25 Issue 8, p3552-3558. 7p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Epoxy+insulators%22">Epoxy insulators</searchLink><br /><searchLink fieldCode="DE" term="%22Nanoindentation%22">Nanoindentation</searchLink><br /><searchLink fieldCode="DE" term="%22Creep+%28Materials%29%22">Creep (Materials)</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+loads%22">Mechanical loads</searchLink><br /><searchLink fieldCode="DE" term="%22Deformations+%28Mechanics%29%22">Deformations (Mechanics)</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: In the present work, the effect of loading rate on indentation creep was studied. Indentation creep tests were conducted on epoxy resin to provide creep deformation under constant load, contact creep compliance and cut-off time using a Berkovich indenter. Several loading rates, ranging from 0.25 to 6 mN/s, were used to perform the tests. The results showed that there is a strong loading rate dependence on creep response of the epoxy resin under indentation. Contact creep compliance and cut-off time decreased with increasing loading rate. In contrast, an increase in reduced modulus, hardness, displacement variation and contact creep compliance variation during the holding time was noticed. The loading rate sensitivity on creep response under indentation can be attributed to viscoelastic response prior to holding segment and strain rate effect on yield stress of the epoxy resin. This study provided an insight to understand the loading rate dependence on creep behaviour of epoxy resin under indentation. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-014-2055-3 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 7 StartPage: 3552 Subjects: – SubjectFull: Epoxy insulators Type: general – SubjectFull: Nanoindentation Type: general – SubjectFull: Creep (Materials) Type: general – SubjectFull: Mechanical loads Type: general – SubjectFull: Deformations (Mechanics) Type: general Titles: – TitleFull: Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Fu, Kunkun – PersonEntity: Name: NameFull: Chang, Yuan – PersonEntity: Name: NameFull: Tang, Youhong – PersonEntity: Name: NameFull: Zheng, Bailin IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Text: Aug2014 Type: published Y: 2014 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 25 – Type: issue Value: 8 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
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