Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation.

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Title: Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation.
Authors: Fu, Kunkun stone_fkk@163.com, Chang, Yuan1, Tang, Youhong2 youhong.tang@flinders.edu.au, Zheng, Bailin3
Source: Journal of Materials Science: Materials in Electronics. Aug2014, Vol. 25 Issue 8, p3552-3558. 7p.
Subjects: Epoxy insulators, Nanoindentation, Creep (Materials), Mechanical loads, Deformations (Mechanics)
Abstract: In the present work, the effect of loading rate on indentation creep was studied. Indentation creep tests were conducted on epoxy resin to provide creep deformation under constant load, contact creep compliance and cut-off time using a Berkovich indenter. Several loading rates, ranging from 0.25 to 6 mN/s, were used to perform the tests. The results showed that there is a strong loading rate dependence on creep response of the epoxy resin under indentation. Contact creep compliance and cut-off time decreased with increasing loading rate. In contrast, an increase in reduced modulus, hardness, displacement variation and contact creep compliance variation during the holding time was noticed. The loading rate sensitivity on creep response under indentation can be attributed to viscoelastic response prior to holding segment and strain rate effect on yield stress of the epoxy resin. This study provided an insight to understand the loading rate dependence on creep behaviour of epoxy resin under indentation. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation.
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  Data: <searchLink fieldCode="AR" term="%22Fu%2C+Kunkun%22">Fu, Kunkun</searchLink><i> stone_fkk@163.com</i><br /><searchLink fieldCode="AR" term="%22Chang%2C+Yuan%22">Chang, Yuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Tang%2C+Youhong%22">Tang, Youhong</searchLink><relatesTo>2</relatesTo><i> youhong.tang@flinders.edu.au</i><br /><searchLink fieldCode="AR" term="%22Zheng%2C+Bailin%22">Zheng, Bailin</searchLink><relatesTo>3</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Aug2014, Vol. 25 Issue 8, p3552-3558. 7p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Epoxy+insulators%22">Epoxy insulators</searchLink><br /><searchLink fieldCode="DE" term="%22Nanoindentation%22">Nanoindentation</searchLink><br /><searchLink fieldCode="DE" term="%22Creep+%28Materials%29%22">Creep (Materials)</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+loads%22">Mechanical loads</searchLink><br /><searchLink fieldCode="DE" term="%22Deformations+%28Mechanics%29%22">Deformations (Mechanics)</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: In the present work, the effect of loading rate on indentation creep was studied. Indentation creep tests were conducted on epoxy resin to provide creep deformation under constant load, contact creep compliance and cut-off time using a Berkovich indenter. Several loading rates, ranging from 0.25 to 6 mN/s, were used to perform the tests. The results showed that there is a strong loading rate dependence on creep response of the epoxy resin under indentation. Contact creep compliance and cut-off time decreased with increasing loading rate. In contrast, an increase in reduced modulus, hardness, displacement variation and contact creep compliance variation during the holding time was noticed. The loading rate sensitivity on creep response under indentation can be attributed to viscoelastic response prior to holding segment and strain rate effect on yield stress of the epoxy resin. This study provided an insight to understand the loading rate dependence on creep behaviour of epoxy resin under indentation. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-014-2055-3
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 7
        StartPage: 3552
    Subjects:
      – SubjectFull: Epoxy insulators
        Type: general
      – SubjectFull: Nanoindentation
        Type: general
      – SubjectFull: Creep (Materials)
        Type: general
      – SubjectFull: Mechanical loads
        Type: general
      – SubjectFull: Deformations (Mechanics)
        Type: general
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      – TitleFull: Effect of loading rate on the creep behaviour of epoxy resin insulators by nanoindentation.
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            NameFull: Fu, Kunkun
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            NameFull: Chang, Yuan
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            NameFull: Tang, Youhong
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            NameFull: Zheng, Bailin
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            – D: 01
              M: 08
              Text: Aug2014
              Type: published
              Y: 2014
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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