2014 Design Software Review: Interoperability.
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| Title: | 2014 Design Software Review: Interoperability. |
|---|---|
| Source: | Microwave Journal. Jul2014, Vol. 57 Issue 7, p22-42. 11p. |
| Subjects: | Internetworking telecommunication software, Simulation software, Agilent Technologies Inc., Ansys Inc., Sonnet Software Inc. |
| Abstract: | The article evaluates several interoperability-related software including Advanced Design System (ADS) 2014 from Agilent Technologies Inc., the high frequency structural simulator (HFSS) three-dimensional (3D) layout from ANSYS Inc., and the Blink™ multi-solver passive device modeling suite from Sonnet. |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 97046639 AccessLevel: 6 PubType: Periodical PubTypeId: serialPeriodical PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: 2014 Design Software Review: Interoperability. – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Microwave+Journal%22">Microwave Journal</searchLink>. Jul2014, Vol. 57 Issue 7, p22-42. 11p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Internetworking+telecommunication+software%22">Internetworking telecommunication software</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+software%22">Simulation software</searchLink><br /><searchLink fieldCode="DE" term="%22Agilent+Technologies+Inc%2E%22">Agilent Technologies Inc.</searchLink><br /><searchLink fieldCode="DE" term="%22Ansys+Inc%2E%22">Ansys Inc.</searchLink><br /><searchLink fieldCode="DE" term="%22Sonnet+Software+Inc%2E%22">Sonnet Software Inc.</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The article evaluates several interoperability-related software including Advanced Design System (ADS) 2014 from Agilent Technologies Inc., the high frequency structural simulator (HFSS) three-dimensional (3D) layout from ANSYS Inc., and the Blink™ multi-solver passive device modeling suite from Sonnet. |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=97046639 |
| RecordInfo | BibRecord: BibEntity: Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 22 Subjects: – SubjectFull: Internetworking telecommunication software Type: general – SubjectFull: Simulation software Type: general – SubjectFull: Agilent Technologies Inc. Type: general – SubjectFull: Ansys Inc. Type: general – SubjectFull: Sonnet Software Inc. Type: general Titles: – TitleFull: 2014 Design Software Review: Interoperability. Type: main BibRelationships: IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: Jul2014 Type: published Y: 2014 Identifiers: – Type: issn-print Value: 01926225 Numbering: – Type: volume Value: 57 – Type: issue Value: 7 Titles: – TitleFull: Microwave Journal Type: main |
| ResultId | 1 |