2014 Design Software Review: Interoperability.

Saved in:
Bibliographic Details
Title: 2014 Design Software Review: Interoperability.
Source: Microwave Journal. Jul2014, Vol. 57 Issue 7, p22-42. 11p.
Subjects: Internetworking telecommunication software, Simulation software, Agilent Technologies Inc., Ansys Inc., Sonnet Software Inc.
Abstract: The article evaluates several interoperability-related software including Advanced Design System (ADS) 2014 from Agilent Technologies Inc., the high frequency structural simulator (HFSS) three-dimensional (3D) layout from ANSYS Inc., and the Blink™ multi-solver passive device modeling suite from Sonnet.
Database: Engineering Source
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 97046639
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: 2014 Design Software Review: Interoperability.
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Microwave+Journal%22">Microwave Journal</searchLink>. Jul2014, Vol. 57 Issue 7, p22-42. 11p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Internetworking+telecommunication+software%22">Internetworking telecommunication software</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+software%22">Simulation software</searchLink><br /><searchLink fieldCode="DE" term="%22Agilent+Technologies+Inc%2E%22">Agilent Technologies Inc.</searchLink><br /><searchLink fieldCode="DE" term="%22Ansys+Inc%2E%22">Ansys Inc.</searchLink><br /><searchLink fieldCode="DE" term="%22Sonnet+Software+Inc%2E%22">Sonnet Software Inc.</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The article evaluates several interoperability-related software including Advanced Design System (ADS) 2014 from Agilent Technologies Inc., the high frequency structural simulator (HFSS) three-dimensional (3D) layout from ANSYS Inc., and the Blink™ multi-solver passive device modeling suite from Sonnet.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=97046639
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 22
    Subjects:
      – SubjectFull: Internetworking telecommunication software
        Type: general
      – SubjectFull: Simulation software
        Type: general
      – SubjectFull: Agilent Technologies Inc.
        Type: general
      – SubjectFull: Ansys Inc.
        Type: general
      – SubjectFull: Sonnet Software Inc.
        Type: general
    Titles:
      – TitleFull: 2014 Design Software Review: Interoperability.
        Type: main
  BibRelationships:
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 07
              Text: Jul2014
              Type: published
              Y: 2014
          Identifiers:
            – Type: issn-print
              Value: 01926225
          Numbering:
            – Type: volume
              Value: 57
            – Type: issue
              Value: 7
          Titles:
            – TitleFull: Microwave Journal
              Type: main
ResultId 1