Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating.
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| Title: | Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating. |
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| Authors: | Petukhov, Dmitrii I.1,2 petukhov@inorg.chem.msu.ru, Kirikova, Marina N.1, Bessonov, Alexander A.1, Bailey, Marc J. A.1 |
| Source: | Materials Letters. Oct2014, Vol. 132, p302-306. 5p. |
| Subjects: | Copper-nickel alloys, Microfabrication, Ink-jet printing, Electroless plating, Electronic equipment, Metal coating |
| Abstract: | A simple, low-cost and easy scale-up technique for fabrication of conductive interconnects for flexible electronic devices is presented. A thin seed layer of nickel or copper was formed on the surface of PEN substrate via reactive inkjet printing of metal salt and reducing agent instead of traditional seed layers such as palladium nanoparticles and palladium or silver salts. For deposition of a uniform metal coating a polymer substrate patterned with the seed layer was immersed in an electroless plating bath. The electrical resistivity of deposited nickel-phosphorus and copper layers was 3.8±0.2 mΩ·cm and 29±2 µΩ·cm, respectively. The obtained structures possess excellent adhesion to polymeric substrates and reveal only slight decrease of conductivity after 20,000 bending cycles. [ABSTRACT FROM AUTHOR] |
| Copyright of Materials Letters is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 97187443 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.matlet.2014.06.109 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 5 StartPage: 302 Subjects: – SubjectFull: Copper-nickel alloys Type: general – SubjectFull: Microfabrication Type: general – SubjectFull: Ink-jet printing Type: general – SubjectFull: Electroless plating Type: general – SubjectFull: Electronic equipment Type: general – SubjectFull: Metal coating Type: general Titles: – TitleFull: Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Petukhov, Dmitrii I. – PersonEntity: Name: NameFull: Kirikova, Marina N. – PersonEntity: Name: NameFull: Bessonov, Alexander A. – PersonEntity: Name: NameFull: Bailey, Marc J. A. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 10 Text: Oct2014 Type: published Y: 2014 Identifiers: – Type: issn-print Value: 0167577X Numbering: – Type: volume Value: 132 Titles: – TitleFull: Materials Letters Type: main |
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