Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit.
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| Title: | Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit. |
|---|---|
| Authors: | Ellsworth Jr., Michael J.1, Zoodsma, Randy J.2, Caseio, Frank1, Behrendt, Eileen1 |
| Source: | Journal of Electronic Packaging. Dec2014, Vol. 136 Issue 4, p1-9. 9p. |
| Subjects: | Thermoelectric cooling, Computer cooling, Electronic packaging, Chip scale packaging, Supercomputers |
| Abstract: | In 2011, IBM announced the Power 775 supercomputing node/system which, for the time, was a significant increase in computing performance and energy efficiency. The system was designed from the start with water cooling in mind. The result: a system with greater than 95% of its heat load conducted directly to water and a system that, together with a rear door heat exchanger (HX), removes 100% of its heat load to water with no requirement for room air conditioning. In addition to direct water cooling the processor, the memory, power conversion, and input-output electronics also conduct their heat directly to water. Also included within the framework of the system is a disk storage unit (i.e., disk enclosure) containing an interboard air-to-water HX. The heart of the water cooling system is the water conditioning unit (WCU). The WCU circulates system water at a controlled temperature and flow rate while also transferring the electronics heat load to the data center facility building chilled water (BCW) system. The brain for this system is the motor drive and control assembly (MDA-WCU). In addition to the pump motor drive function, the MDA-WCU contains the control circuitry and associated firmware that maintains system water at a prescribed temperature above the room dew point irrespective of system and or facilities thermal/flow transients. It is also capable of error detection and fault isolation that, together with higher level system firmware, facilitates serviceability, and availability. The paper will present the WCU and MDA-WCU design with an emphasis on the control methodologies and algorithms. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 99775158 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Ellsworth+Jr%2E%2C+Michael+J%2E%22">Ellsworth Jr., Michael J.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Zoodsma%2C+Randy+J%2E%22">Zoodsma, Randy J.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Caseio%2C+Frank%22">Caseio, Frank</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Behrendt%2C+Eileen%22">Behrendt, Eileen</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>. Dec2014, Vol. 136 Issue 4, p1-9. 9p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Thermoelectric+cooling%22">Thermoelectric cooling</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+cooling%22">Computer cooling</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Chip+scale+packaging%22">Chip scale packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Supercomputers%22">Supercomputers</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: In 2011, IBM announced the Power 775 supercomputing node/system which, for the time, was a significant increase in computing performance and energy efficiency. The system was designed from the start with water cooling in mind. The result: a system with greater than 95% of its heat load conducted directly to water and a system that, together with a rear door heat exchanger (HX), removes 100% of its heat load to water with no requirement for room air conditioning. In addition to direct water cooling the processor, the memory, power conversion, and input-output electronics also conduct their heat directly to water. Also included within the framework of the system is a disk storage unit (i.e., disk enclosure) containing an interboard air-to-water HX. The heart of the water cooling system is the water conditioning unit (WCU). The WCU circulates system water at a controlled temperature and flow rate while also transferring the electronics heat load to the data center facility building chilled water (BCW) system. The brain for this system is the motor drive and control assembly (MDA-WCU). In addition to the pump motor drive function, the MDA-WCU contains the control circuitry and associated firmware that maintains system water at a prescribed temperature above the room dew point irrespective of system and or facilities thermal/flow transients. It is also capable of error detection and fault isolation that, together with higher level system firmware, facilitates serviceability, and availability. The paper will present the WCU and MDA-WCU design with an emphasis on the control methodologies and algorithms. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1115/1.4028119 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 1 Subjects: – SubjectFull: Thermoelectric cooling Type: general – SubjectFull: Computer cooling Type: general – SubjectFull: Electronic packaging Type: general – SubjectFull: Chip scale packaging Type: general – SubjectFull: Supercomputers Type: general Titles: – TitleFull: Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ellsworth Jr., Michael J. – PersonEntity: Name: NameFull: Zoodsma, Randy J. – PersonEntity: Name: NameFull: Caseio, Frank – PersonEntity: Name: NameFull: Behrendt, Eileen IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2014 Type: published Y: 2014 Identifiers: – Type: issn-print Value: 10437398 Numbering: – Type: volume Value: 136 – Type: issue Value: 4 Titles: – TitleFull: Journal of Electronic Packaging Type: main |
| ResultId | 1 |
