Ultrathick Interlayer Coupled Reduced Graphene Oxide Films for Multidirectional Heat Transport and Electrothermal Energy Conversion.
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| Title: | Ultrathick Interlayer Coupled Reduced Graphene Oxide Films for Multidirectional Heat Transport and Electrothermal Energy Conversion. |
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| Authors: | Ding, Ling1 (AUTHOR), Zhang, Jiawen1,2 (AUTHOR), Xu, Tianqi1,2 (AUTHOR), Jiang, Xunyuan1 (AUTHOR), Ji, Jinpeng1 (AUTHOR), Liu, Yu1 (AUTHOR), Geng, Jianxin2,3 (AUTHOR), Rümmeli, Mark Hermann1,4,5,6 (AUTHOR), Geng, Fengxia1 (AUTHOR) Gengfx@Suda.Edu.Cn |
| Source: | Advanced Energy Materials. 6/10/2026, Vol. 16 Issue 22, p1-11. 11p. |
| Subject Terms: | *Graphene oxide, *Thermal conductivity, *Graphene, *Electric heating, *Heat transfer, *Resistance heating, *Temperature control equipment |
| Abstract: | Efficient thermal management remains a key challenge for high‐power electronics due to the limited availability of materials capable of withstanding extreme heat fluxes (>1000 W·cm−2). Although individual graphene sheets exhibit exceptional intrinsic thermal conductivities, stacked graphene films suffer from severe thermal anisotropy and poor through‐plane heat transport because of the weak van der Waals interactions. Here, we report a scalable strategy to construct interlayer‐coupled reduced graphene oxide (rGO) films with covalent carbon bonding across stacking layers. Partially oxidized GO films with controlled hydroxyl densities are first connected by aryl ether bridges via nucleophilic aromatic substitution, which transform into robust carbon linkages upon graphitization. A representative 200 µm‐thick film simultaneously exhibits high in‐plane and through‐plane thermal conductivities of 1465 ± 63 and 14.0 ± 1.2 W·m−1·K−1, respectively. Comparable performance is retained at a thickness of 300 µm and temperatures up to 250°C. Under an extreme heat flux of 1200 W·cm−2, the film lowers its temperature by 110°C within 20 s and shows excellent cycling stability. The high thermal and electrical conductivities also enable fast, uniform, and durable electrothermal heating. This work provides a practical route to overcoming the intrinsic anisotropy of graphene assemblies for advanced thermal management applications. [ABSTRACT FROM AUTHOR] |
| Database: | Energy & Power Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: enr DbLabel: Energy & Power Source An: 194548265 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Ultrathick Interlayer Coupled Reduced Graphene Oxide Films for Multidirectional Heat Transport and Electrothermal Energy Conversion. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Ding%2C+Ling%22">Ding, Ling</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Jiawen%22">Zhang, Jiawen</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xu%2C+Tianqi%22">Xu, Tianqi</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jiang%2C+Xunyuan%22">Jiang, Xunyuan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ji%2C+Jinpeng%22">Ji, Jinpeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Yu%22">Liu, Yu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Geng%2C+Jianxin%22">Geng, Jianxin</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Rümmeli%2C+Mark+Hermann%22">Rümmeli, Mark Hermann</searchLink><relatesTo>1,4,5,6</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Geng%2C+Fengxia%22">Geng, Fengxia</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> Gengfx@Suda.Edu.Cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Advanced+Energy+Materials%22">Advanced Energy Materials</searchLink>. 6/10/2026, Vol. 16 Issue 22, p1-11. 11p. – Name: Subject Label: Subject Terms Group: Su Data: *<searchLink fieldCode="DE" term="%22Graphene+oxide%22">Graphene oxide</searchLink><br />*<searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink><br />*<searchLink fieldCode="DE" term="%22Graphene%22">Graphene</searchLink><br />*<searchLink fieldCode="DE" term="%22Electric+heating%22">Electric heating</searchLink><br />*<searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink><br />*<searchLink fieldCode="DE" term="%22Resistance+heating%22">Resistance heating</searchLink><br />*<searchLink fieldCode="DE" term="%22Temperature+control+equipment%22">Temperature control equipment</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Efficient thermal management remains a key challenge for high‐power electronics due to the limited availability of materials capable of withstanding extreme heat fluxes (>1000 W·cm−2). Although individual graphene sheets exhibit exceptional intrinsic thermal conductivities, stacked graphene films suffer from severe thermal anisotropy and poor through‐plane heat transport because of the weak van der Waals interactions. Here, we report a scalable strategy to construct interlayer‐coupled reduced graphene oxide (rGO) films with covalent carbon bonding across stacking layers. Partially oxidized GO films with controlled hydroxyl densities are first connected by aryl ether bridges via nucleophilic aromatic substitution, which transform into robust carbon linkages upon graphitization. A representative 200 µm‐thick film simultaneously exhibits high in‐plane and through‐plane thermal conductivities of 1465 ± 63 and 14.0 ± 1.2 W·m−1·K−1, respectively. Comparable performance is retained at a thickness of 300 µm and temperatures up to 250°C. Under an extreme heat flux of 1200 W·cm−2, the film lowers its temperature by 110°C within 20 s and shows excellent cycling stability. The high thermal and electrical conductivities also enable fast, uniform, and durable electrothermal heating. This work provides a practical route to overcoming the intrinsic anisotropy of graphene assemblies for advanced thermal management applications. [ABSTRACT FROM AUTHOR] |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1002/aenm.70909 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 1 Subjects: – SubjectFull: Graphene oxide Type: general – SubjectFull: Thermal conductivity Type: general – SubjectFull: Graphene Type: general – SubjectFull: Electric heating Type: general – SubjectFull: Heat transfer Type: general – SubjectFull: Resistance heating Type: general – SubjectFull: Temperature control equipment Type: general Titles: – TitleFull: Ultrathick Interlayer Coupled Reduced Graphene Oxide Films for Multidirectional Heat Transport and Electrothermal Energy Conversion. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ding, Ling – PersonEntity: Name: NameFull: Zhang, Jiawen – PersonEntity: Name: NameFull: Xu, Tianqi – PersonEntity: Name: NameFull: Jiang, Xunyuan – PersonEntity: Name: NameFull: Ji, Jinpeng – PersonEntity: Name: NameFull: Liu, Yu – PersonEntity: Name: NameFull: Geng, Jianxin – PersonEntity: Name: NameFull: Rümmeli, Mark Hermann – PersonEntity: Name: NameFull: Geng, Fengxia IsPartOfRelationships: – BibEntity: Dates: – D: 10 M: 06 Text: 6/10/2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 16146832 Numbering: – Type: volume Value: 16 – Type: issue Value: 22 Titles: – TitleFull: Advanced Energy Materials Type: main |
| ResultId | 1 |